Inventor · disambiguated record
Swee Peng Lee
Also filed as: LEE SWEE PENG
2 granted patents·31 citations·filing 2004–2004
62Inventor score
Technology areasY10S
Files withADVANCED MICRO DEVICES INC2
Top patents by PatentIndex Score
2 records- 0161US7052968B1Method and system for aligning IC die to package substrateADVANCED MICRO DEVICES INC·Filed 2004·Granted May 30, 2006·19 cites·36 claims
- 0248US7030772B1Inspection for alignment between IC die and package substrateADVANCED MICRO DEVICES INC·Filed 2004·Granted Apr 18, 2006·12 cites·32 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →