Inventor · disambiguated record
Sy-Hwa Chen
Also filed as: CHEN SY-HWA
11 granted patents·2,218 citations·filing 1988–1992
95Inventor score
Top patents by PatentIndex Score
11 records- 0199US5116568AMethod for low pressure bonding of PCD bodiesNORTON CO·Filed 1991·Granted May 26, 1992·261 cites·17 claims
- 0299US5096465ADiamond metal composite cutter and method for making sameNORTON CO·Filed 1989·Granted Mar 17, 1992·359 cites·78 claims
- 0398US5151107ACemented and cemented/sintered superabrasive polycrystalline bodies and methods of manufacture thereofNORTON CO·Filed 1988·Granted Sep 29, 1992·228 cites·47 claims
- 0498US5030276ALow pressure bonding of PCD bodies and methodNORTON CO·Filed 1988·Granted Jul 9, 1991·324 cites·76 claims
- 0598US5011514ACemented and cemented/sintered superabrasive polycrystalline bodies and methods of manufacture thereofNORTON CO·Filed 1989·Granted Apr 30, 1991·412 cites·39 claims
- 0698US4943488ALow pressure bonding of PCD bodies and method for drill bits and the likeNORTON CO·Filed 1988·Granted Jul 24, 1990·333 cites·50 claims
- 0796US5024680AMultiple metal coated superabrasive grit and methods for their manufactureNORTON CO·Filed 1988·Granted Jun 18, 1991·120 cites·32 claims
- 0890US5224969ADiamond having multiple coatings and methods for their manufactureNORTON CO·Filed 1992·Granted Jul 6, 1993·68 cites·9 claims
- 0988US5062865AChemically bonded superabrasive gritNORTON CO·Filed 1989·Granted Nov 5, 1991·77 cites·22 claims
- 1055US5126207ADiamond having multiple coatings and methods for their manufactureNORTON CO·Filed 1990·Granted Jun 30, 1992·16 cites·9 claims
- 1153US5359170AApparatus for bonding external leads of an integrated circuitAT & T GLOBAL INF SOLUTION·Filed 1992·Granted Oct 25, 1994·20 cites·3 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →