Inventor · disambiguated record
Sychyi Fang
Also filed as: FANG SYCHYI
7 granted patents·1 pending application·413 citations·filing 1996–2009
89Inventor score
Technology areasH10W
Top patents by PatentIndex Score
8 records- 0190US6309956B1Fabricating low K dielectric interconnect systems by using dummy structures to enhance processINTEL CORP·Filed 1999·Granted Oct 30, 2001·138 cites·6 claims
- 0290US5886410AInterconnect structure with hard mask and low dielectric constant materialsINTEL CORP·Filed 1996·Granted Mar 23, 1999·110 cites·14 claims
- 0381US6027995AMethod for fabricating an interconnect structure with hard mask and low dielectric constant materialsINTEL CORP·Filed 1998·Granted Feb 22, 2000·59 cites·8 claims
- 0481US5935868AInterconnect structure and method to achieve unlanded vias for low dielectric constant materialsINTEL CORP·Filed 1997·Granted Aug 10, 1999·69 cites·36 claims
- 0578US7605092B2Passive elements, articles, packages, semiconductor composites, and methods of manufacturing sameSILICON STORAGE TECH INC·Filed 2007·Granted Oct 20, 2009·6 cites·54 claims
- 0665US5880030AUnlanded via structure and method for making sameINTEL CORP·Filed 1997·Granted Mar 9, 1999·30 cites·13 claims
- 0758US8258065B2Passive elements, articles, packages, semiconductor composites, and methods of manufacturing sameCHEN BOMY·Filed 2009·Granted Sep 4, 2012·1 cites·39 claims
- 0842US2008169539A1Under bump metallurgy structure of a package and method of making sameADV CHIP ENG TECH INC·Filed 2007·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →