Inventor · disambiguated record
Syojiro Kodai
Also filed as: KODAI SYOJIRO
14 granted patents·1,010 citations·filing 1986–1996
95Inventor score
Files withMITSUBISHI ELECTRIC CORP14
Top patents by PatentIndex Score
14 records- 0196US5272374AProduction method for an IC card and its IC cardMITSUBISHI ELECTRIC CORP·Filed 1991·Granted Dec 21, 1993·106 cites·11 claims
- 0295US4974120AIC cardMITSUBISHI ELECTRIC CORP·Filed 1989·Granted Nov 27, 1990·157 cites·3 claims
- 0393US5735040AMethod of making IC cardMITSUBISHI ELECTRIC CORP·Filed 1996·Granted Apr 7, 1998·122 cites·8 claims
- 0490US5416358AIC card including frame with lateral hole for injecting encapsulating resinMITSUBISHI ELECTRIC CORP·Filed 1993·Granted May 16, 1995·116 cites·11 claims
- 0589US5250341AIC cardMITSUBISHI ELECTRIC CORP·Filed 1991·Granted Oct 5, 1993·69 cites·16 claims
- 0689US4695925AIC cardMITSUBISHI ELECTRIC CORP·Filed 1986·Granted Sep 22, 1987·71 cites·6 claims
- 0785US5026452AMethod of producing IC cardsMITSUBISHI ELECTRIC CORP·Filed 1989·Granted Jun 25, 1991·69 cites·9 claims
- 0880US5677568AThin IC cardMITSUBISHI ELECTRIC CORP·Filed 1992·Granted Oct 14, 1997·62 cites·7 claims
- 0980US5461256APortable semiconductor device with resinMITSUBISHI ELECTRIC CORP·Filed 1993·Granted Oct 24, 1995·73 cites·27 claims
- 1078US5498388AProduction method for an IC cardMITSUBISHI ELECTRIC CORP·Filed 1995·Granted Mar 12, 1996·54 cites·4 claims
- 1171US5520863AMethod of making IC cardMITSUBISHI ELECTRIC CORP·Filed 1994·Granted May 28, 1996·29 cites·1 claims
- 1266US5079673AIc card moduleMITSUBISHI ELECTRIC CORP·Filed 1990·Granted Jan 7, 1992·37 cites·6 claims
- 1361US5192682AManufacturing method for thin semiconductor device assembliesMITSUBISHI ELECTRIC CORP·Filed 1991·Granted Mar 9, 1993·30 cites·8 claims
- 1458US5346576AMethod of manufacturing IC cardMITSUBISHI ELECTRIC CORP·Filed 1993·Granted Sep 13, 1994·15 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →