Inventor · disambiguated record

Syufong Li

Also filed as: LI SYUFONG

2 granted patents·3 pending applications·0 citations·filing 2022–2025

30Inventor score

Technology areasH10W

Files withTAIWAN SEMICONDUCTOR MFG CO LTD5

Top patents by PatentIndex Score

5 records

0179US12334465B2Semiconductor package and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Jun 17, 2025·0 cites·20 claims
0277US2025286007A1Semiconductor package and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
0373US2025349764A1Bonding structure with stress buffer zone and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
0470US11984422B2Semiconductor package and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted May 14, 2024·0 cites·20 claims
0553US2024312857A1Semiconductor structure and method of fabricating sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →