Inventor · disambiguated record
Syunsuke Takeuchi
Also filed as: TAKEUCHI SYUNSUKE
13 granted patents·19 citations·filing 2010–2019
86Inventor score
Top patents by PatentIndex Score
13 records- 0186US8411409B2Ceramic electronic component and manufacturing method thereforOGAWA MAKOTO·Filed 2011·Granted Apr 2, 2013·6 cites·10 claims
- 0284US8520361B2Laminated electronic componentMOTOKI AKIHIRO·Filed 2011·Granted Aug 27, 2013·5 cites·3 claims
- 0376US9536669B2Laminated ceramic electronic component and manufacturing method thereforMURATA MANUFACTURING CO·Filed 2015·Granted Jan 3, 2017·1 cites·2 claims
- 0472US9343230B2Chip-type electronic component with outer electrodesMURATA MANUFACTURING CO·Filed 2013·Granted May 17, 2016·2 cites·19 claims
- 0565US9013859B2Laminated electronic component and manufacturing method thereforSARUBAN MASAHITO·Filed 2011·Granted Apr 21, 2015·2 cites·4 claims
- 0664US8334748B2Method for manufacturing ceramic electronic component and ceramic electronic componentTAKEUCHI SYUNSUKE·Filed 2012·Granted Dec 18, 2012·3 cites·8 claims
- 0759US8971015B2Electronic componentMURATA MANUFACTURING CO·Filed 2013·Granted Mar 3, 2015·0 cites·8 claims
- 0855US9123469B2Laminated ceramic electronic component and manufacturing method thereforMOTOKI AKIHIRO·Filed 2011·Granted Sep 1, 2015·0 cites·3 claims
- 0948US8355241B2Laminated electronic componentMURATA MANUFACTURING CO·Filed 2010·Granted Jan 15, 2013·0 cites·3 claims
- 1047US8717739B2Ceramic electronic componentYAMAMOTO YOJI·Filed 2012·Granted May 6, 2014·0 cites·7 claims
- 1146US8508913B2Laminate type electronic component and manufacturing method thereforSARUBAN MASAHITO·Filed 2011·Granted Aug 13, 2013·0 cites·7 claims
- 1244US11158459B2Ceramic electronic component and method for manufacturing ceramic electronic componentMURATA MANUFACTURING CO·Filed 2019·Granted Oct 26, 2021·0 cites·20 claims
- 1344US8553391B2Electronic componentTAKEUCHI SYUNSUKE·Filed 2011·Granted Oct 8, 2013·0 cites·4 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →