Inventor · disambiguated record
Syoji Ubukata
Also filed as: UBUKATA SYOJI
1 granted patent·1 pending application·0 citations·filing 2011–2014
5Inventor score
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2 records- 0145US9809735B2Highly-thermally-conductive resin composition, and resin material for heat dissipation/heat transfer and thermally conductive film comprising sameKANEKA CORP·Filed 2014·Granted Nov 7, 2017·0 cites·10 claims
- 0238US2013202882A1Highly thermally conductive resin molded article, and manufacturing method for sameUCHIDA SOICHI·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →