Inventor · disambiguated record
Szu-Ying Chen
Also filed as: CHEN SZU-YING
123 granted patents·23 pending applications·1,813 citations·filing 2010–2025
99Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD102TAIWAN SEMICONDUCTOR MFG25CHEN SZU-YING10WAN MENG-HSUN2HTC CORP1
Top patents by PatentIndex Score
146 records- 0198US9960142B2Hybrid bonding with air-gap structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted May 1, 2018·222 cites·20 claims
- 0298US9337235B2Method and apparatus for image sensor packagingTAIWAN SEMICONDUCTOR MFG·Filed 2015·Granted May 10, 2016·227 cites·20 claims
- 0398US9312229B2Hybrid bonding with air-gap structureTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Apr 12, 2016·228 cites·20 claims
- 0498US9299736B2Hybrid bonding with uniform pattern densityTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Mar 29, 2016·235 cites·20 claims
- 0598US9230941B2Bonding structure for stacked semiconductor devicesTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Jan 5, 2016·240 cites·20 claims
- 0698US9142517B2Hybrid bonding mechanisms for semiconductor wafersTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted Sep 22, 2015·247 cites·17 claims
- 0798US8390089B2Image sensor with deep trench isolation structureCHEN SZU-YING·Filed 2010·Granted Mar 5, 2013·53 cites·20 claims
- 0897US11996399B2Hybrid bonding with uniform pattern densityTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted May 28, 2024·2 cites·20 claims
- 0997US9960129B2Hybrid bonding mechanisms for semiconductor wafersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted May 1, 2018·22 cites·17 claims
- 1096US8957358B2CMOS image sensor chips with stacked scheme and methods for forming the sameWAN MENG-HSUN·Filed 2012·Granted Feb 17, 2015·37 cites·20 claims
- 1196US8878325B2Elevated photodiode with a stacked schemeTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted Nov 4, 2014·12 cites·20 claims
- 1296US8629524B2Apparatus for vertically integrated backside illuminated image sensorsWANG TZU-JUI·Filed 2012·Granted Jan 14, 2014·26 cites·12 claims
- 1396US8455971B2Apparatus and method for improving charge transfer in backside illuminated image sensorCHEN SZU-YING·Filed 2011·Granted Jun 4, 2013·35 cites·20 claims
- 1495US9257414B2Stacked semiconductor structure and methodTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Feb 9, 2016·14 cites·20 claims
- 1595US9190345B1Semiconductor devices and methods of manufacture thereofTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Nov 17, 2015·24 cites·20 claims
- 1695US9136302B2Apparatus for vertically integrated backside illuminated image sensorsTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Sep 15, 2015·11 cites·20 claims
- 1794US10090349B2CMOS image sensor chips with stacked scheme and methods for forming the sameWAN MENG HSUN·Filed 2012·Granted Oct 2, 2018·18 cites·20 claims
- 1894US9123615B2Vertically integrated image sensor chips and methods for forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Sep 1, 2015·11 cites·20 claims
- 1993US9153565B2Image sensors with a high fill-factorCHEN SZU-YING·Filed 2012·Granted Oct 6, 2015·14 cites·20 claims
- 2092US10157889B2Stacked semiconductor structure and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 18, 2018·5 cites·20 claims
- 2192US8883544B2Method of forming an image deviceCHEN SZU-YING·Filed 2012·Granted Nov 11, 2014·5 cites·20 claims
- 2291US10304818B2Method of manufacturing semiconductor devices having conductive plugs with varying widthsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted May 28, 2019·5 cites·18 claims
- 2391US9412725B2Method and apparatus for image sensor packagingCHEN SZU-YING·Filed 2012·Granted Aug 9, 2016·12 cites·23 claims
- 2491US9293502B2Semiconductor switching device separated by device isolationTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Mar 22, 2016·4 cites·20 claims
- 2591US9123617B2Elevated photodiode with a stacked schemeTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Sep 1, 2015·4 cites·20 claims
- 2690US9455158B23DIC interconnect devices and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Sep 27, 2016·10 cites·20 claims
- 2790US8946784B2Method and apparatus for image sensor packagingTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Feb 3, 2015·8 cites·20 claims
- 2889US9530811B2Elevated photodiode with a stacked schemeTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Dec 27, 2016·4 cites·20 claims
- 2989US9443836B2Forming pixel units of image sensors through bonding two chipsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Sep 13, 2016·8 cites·20 claims
- 3088US10388642B2Hybrid bonding with uniform pattern densityTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Aug 20, 2019·4 cites·20 claims
- 3188US9406711B2Apparatus and method for backside illuminated image sensorsCHEN SZU-YING·Filed 2012·Granted Aug 2, 2016·5 cites·20 claims
- 3288US8933527B2Elevated photodiodes with crosstalk isolationTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted Jan 13, 2015·5 cites·19 claims
- 3387US12424605B2Hybrid bonding with uniform pattern densityTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Sep 23, 2025·0 cites·20 claims
- 3486US11600653B2Methods and apparatus for via last through-viasTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Mar 7, 2023·3 cites·19 claims
- 3586US9917123B2Method and apparatus for image sensor packagingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Mar 13, 2018·4 cites·20 claims
- 3686US9287310B2Methods and apparatus for glass removal in CMOS image sensorsTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted Mar 15, 2016·3 cites·19 claims
- 3786US2025318262A1Semiconductor device and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 3885US12369394B2Semiconductor device and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Jul 22, 2025·0 cites·20 claims
- 3985US11978758B2Methods and apparatus for via last through-viasTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted May 7, 2024·1 cites·20 claims
- 4085US9941249B2Multi-wafer stacking by Ox-Ox bondingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Apr 10, 2018·4 cites·20 claims
- 4184US9536777B2Interconnect apparatus and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Jan 3, 2017·5 cites·15 claims
- 4284US8710607B2Method and apparatus for image sensor packagingCHEN SZU-YING·Filed 2012·Granted Apr 29, 2014·5 cites·20 claims
- 4383US12148781B2Image sensor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Nov 19, 2024·0 cites·20 claims
- 4483US12068287B2Stacked semiconductor structure and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Aug 20, 2024·0 cites·20 claims
- 4583US10062721B2Elevated photodiode with a stacked schemeTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Aug 28, 2018·2 cites·20 claims
- 4683US9281334B2Pickup device structure within a device isolation regionTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Mar 8, 2016·2 cites·20 claims
- 4783US2025301746A1Reducing k values of dielectric films through annealTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 4882US12426335B2Reducing k values of dielectric films through annealTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Sep 23, 2025·0 cites·20 claims
- 4982US12419100B2Transistor isolation regions and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Sep 16, 2025·0 cites·20 claims
- 5082US10096645B2Method and apparatus for image sensor packagingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Oct 9, 2018·3 cites·20 claims
Showing the top 50 of 146 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →