Inventor · disambiguated record
Sze Ping Goh
Also filed as: GOH SZE PING
2 granted patents·14 citations·filing 2015–2019
53Inventor score
Technology areasH10W
Top patents by PatentIndex Score
2 records- 0194US10453785B2Semiconductor device and method of forming double-sided fan-out wafer level packageSTATS CHIPPAC LTD·Filed 2015·Granted Oct 22, 2019·14 cites·25 claims
- 0257US11127668B2Semiconductor device and method of forming double-sided fan-out wafer level packageJCET SEMICONDUCTOR SHAOXING CO LTD·Filed 2019·Granted Sep 21, 2021·0 cites·24 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →