Inventor · disambiguated record
Szu-Po Huang
Also filed as: HUANG SZU-PO
31 granted patents·6 pending applications·337 citations·filing 2009–2025
97Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD26TAIWAN SEMICONDUCTOR MFG7IND TECH RES INST2LU CHUN-AN1REALTEK SEMICONDUCTOR CORP1
Top patents by PatentIndex Score
37 records- 0198US10332823B2Packaged semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jun 25, 2019·19 cites·20 claims
- 0298US9780072B23D semiconductor package interposer with die cavityTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Oct 3, 2017·25 cites·20 claims
- 0397US10461009B23DIC packaging with hot spot thermal management featuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Oct 29, 2019·15 cites·20 claims
- 0497US10157818B2Methods of cooling packaged semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Dec 18, 2018·19 cites·20 claims
- 0597US10062665B2Semiconductor packages with thermal management features for reduced thermal crosstalkTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Aug 28, 2018·17 cites·20 claims
- 0697US9595506B2Packages with thermal management features for reduced thermal crosstalk and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Mar 14, 2017·18 cites·20 claims
- 0797US9269694B2Packages with thermal management features for reduced thermal crosstalk and methods of forming sameTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Feb 23, 2016·26 cites·20 claims
- 0897US9224673B2Packages for semiconductor devices, packaged semiconductor devices, and methods of cooling packaged semiconductor devicesTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Dec 29, 2015·26 cites·12 claims
- 0997US9082743B23DIC packages with heat dissipation structuresTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jul 14, 2015·24 cites·20 claims
- 1097US9076754B23DIC packages with heat sinks attached to heat dissipating ringsTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jul 7, 2015·34 cites·20 claims
- 1196US9735082B23DIC packaging with hot spot thermal management featuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Aug 15, 2017·16 cites·19 claims
- 1296US9583415B2Packages with thermal interface material on the sidewalls of stacked diesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Feb 28, 2017·30 cites·19 claims
- 1396US9385095B23D semiconductor package interposer with die cavityTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Jul 5, 2016·19 cites·20 claims
- 1493US10446520B23D semiconductor package interposer with die cavityTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Oct 15, 2019·7 cites·20 claims
- 1592US10629545B2Semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 21, 2020·6 cites·20 claims
- 1692US10157813B23DIC packaging with hot spot thermal management featuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 18, 2018·5 cites·20 claims
- 1792US9941251B23DIC packages with heat dissipation structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 10, 2018·6 cites·20 claims
- 1890US9184128B23DIC package and methods of forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Nov 10, 2015·7 cites·20 claims
- 1988US9576938B23DIC packages with heat dissipation structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Feb 21, 2017·4 cites·20 claims
- 2086US2024222218A13dic packaging with hot spot thermal management featuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2185US9978660B2Package with embedded heat dissipation featuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted May 22, 2018·5 cites·20 claims
- 2284US2025062250A1Semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2382US10629510B2Package with embedded heat dissipation featuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Apr 21, 2020·2 cites·20 claims
- 2480US12165990B2Semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Dec 10, 2024·0 cites·20 claims
- 2580US9379036B23DIC packages with heat dissipation structuresTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Jun 28, 2016·3 cites·20 claims
- 2677US11961779B23DIC packaging with hot spot thermal management featuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Apr 16, 2024·0 cites·20 claims
- 2777US2025336889A1Semiconductor package and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2870US9496249B23DIC package and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Nov 15, 2016·1 cites·20 claims
- 2970US8911821B2Method for forming nanometer scale dot-shaped materialsLU CHUN-AN·Filed 2009·Granted Dec 16, 2014·3 cites·13 claims
- 3069US11587886B2Semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Feb 21, 2023·0 cites·20 claims
- 3169US11133237B2Package with embedded heat dissipation featuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Sep 28, 2021·0 cites·20 claims
- 3268US2023378132A1Semiconductor package and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 3365US11037852B23DIC packaging with hot spot thermal management featuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jun 15, 2021·0 cites·20 claims
- 3461US2014318414A1Nano-metal solution and nano-metal complex grainsIND TECH RES INST·Filed 2014·Application pending·0 cites
- 3559US2010166952A1Nano-metal solution, nano-metal complex grains and manufacturing method of metal filmIND TECH RES INST·Filed 2009·Application pending·0 cites
- 3658US9985001B23DIC package and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted May 29, 2018·0 cites·19 claims
- 3755US12464261B2Image processing apparatus and method having lens color-shading correction mechanismREALTEK SEMICONDUCTOR CORP·Filed 2023·Granted Nov 4, 2025·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →