Inventor · disambiguated record
Szu-Chuan Pang
Also filed as: PANG SZU-CHUAN
1 granted patent·3 pending applications·11 citations·filing 2006–2017
33Inventor score
Technology areasH10W
Top patents by PatentIndex Score
4 records- 0183US9831197B1Wafer-level package with metal shielding structure and the manufacturing method thereofSIGURD MICROELECTRONICS CORP·Filed 2017·Granted Nov 28, 2017·11 cites·12 claims
- 0230US2008036053A1Reinforced micro-electromechanical system package structureWU WAN-HUA·Filed 2006·Application pending·0 cites
- 0329US2012025211A1Compact sensor package structureYEH TSAN-LIEN·Filed 2011·Application pending·0 cites
- 0428US2009108418A1Non-leaded semiconductor package structureWU WA-HUA·Filed 2007·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →