Inventor · disambiguated record
Szu-Hsiang Su
Also filed as: SU SZU-HSIANG
8 granted patents·12 pending applications·2 citations·filing 2010–2021
73Inventor score
Files withZHEN DING TECH CO LTD18FUKUI PREC COMPONENT (SHENZHEN) CO LTD1MICROCOSM TECHNOLOGY CO LTD1
Top patents by PatentIndex Score
20 records- 0188US10894882B2Low dielectric resin composition, film and circuit board using the sameZHEN DING TECH CO LTD·Filed 2018·Granted Jan 19, 2021·2 cites·12 claims
- 0272US11261328B2Circuit board using low dielectric resin compositionZHEN DING TECH CO LTD·Filed 2020·Granted Mar 1, 2022·0 cites·10 claims
- 0365US11680138B2Polymer dispersion, method for manufacturing the polymer dispersion, and method for manufacturing polymer composite filmZHEN DING TECH CO LTD·Filed 2020·Granted Jun 20, 2023·0 cites·14 claims
- 0465US11655366B2Transparent polyimide mixture, method for manufacturing the transparent polyimide mixture, and method for manufacturing transparent polyimide filmZHEN DING TECH CO LTD·Filed 2020·Granted May 23, 2023·0 cites·15 claims
- 0558US11859038B2Method for manufacturing a block copolymer of polyamide acidZHEN DING TECH CO LTD·Filed 2020·Granted Jan 2, 2024·0 cites·2 claims
- 0656US2023091989A1Diamine monomer compound, method for preparing the same, resin, flexible film, and electronic deviceZHEN DING TECH CO LTD·Filed 2021·Application pending·0 cites
- 0756US2022135797A1Polyimide film and method for manufacturing sameZHEN DING TECH CO LTD·Filed 2020·Application pending·0 cites
- 0855US2022033663A1Fluorine-containing dispersion and method of manufacturing the same, and fluorine-containing composite filmZHEN DING TECH CO LTD·Filed 2020·Application pending·0 cites
- 0954US2021363384A1Liquid crystal polymer composition, copper substrate, and method for manufacturing the copper substrateZHEN DING TECH CO LTD·Filed 2020·Application pending·0 cites
- 1054US2022002490A1Polyimide component, polyimide film, and polyimide copper clad laminateZHEN DING TECH CO LTD·Filed 2020·Application pending·0 cites
- 1152US11524491B2Method for manufacturing thick polyimide filmZHEN DING TECH CO LTD·Filed 2020·Granted Dec 13, 2022·0 cites·11 claims
- 1252US2023086746A1Diamine monomer compound, method for preparing the same, resin, flexible film, and electronic deviceZHEN DING TECH CO LTD·Filed 2021·Application pending·0 cites
- 1350US2021017336A1Polyamic acid composition, polyimide film, and copper clad laminateZHEN DING TECH CO LTD·Filed 2019·Application pending·0 cites
- 1447US10844174B2Low dielectric polyimide composition, polyimide, polyimide film and copper clad laminate using the sameZHEN DING TECH CO LTD·Filed 2017·Granted Nov 24, 2020·0 cites·1 claims
- 1537US10928730B2Photosensitive resin composition, and polymer film made therefromZHEN DING TECH CO LTD·Filed 2018·Granted Feb 23, 2021·0 cites·12 claims
- 1637US2017369747A1Resin composition, adhesive film, and circuit board using the sameZHEN DING TECH CO LTD·Filed 2016·Application pending·0 cites
- 1735US2018223048A1Resin composition, method for making resin composition and film for circuit board, and circuit boardZHEN DING TECH CO LTD·Filed 2017·Application pending·0 cites
- 1832US2017369653A1Polyamic acid, polyimide, polyimide film and copper clad laminate using the sameZHEN DING TECH CO LTD·Filed 2017·Application pending·0 cites
- 1929US2017079136A1Circuit board and method for making the sameFUKUI PREC COMPONENT (SHENZHEN) CO LTD·Filed 2015·Application pending·0 cites
- 2024US2010252940A1Polyimide shield and integrated circuit structure having the sameMICROCOSM TECHNOLOGY CO LTD·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →