Inventor · disambiguated record
Takema Adachi
Also filed as: ADACHI TAKEMA
31 granted patents·9 pending applications·44 citations·filing 2011–2022
94Inventor score
Top patents by PatentIndex Score
40 records- 0187US10221497B2Method for manufacturing wiring board with conductive postIBIDEN CO LTD·Filed 2015·Granted Mar 5, 2019·2 cites·20 claims
- 0287US9420708B2Method for manufacturing multilayer printed wiring boardHIBINO TOSHIAKI·Filed 2012·Granted Aug 16, 2016·16 cites·20 claims
- 0381US9185799B2Printed wiring boardIBIDEN CO LTD·Filed 2013·Granted Nov 10, 2015·6 cites·20 claims
- 0481US8772646B2Printed wiring board and method for manufacturing printed wiring boardUEDA KAZUYUKI·Filed 2012·Granted Jul 8, 2014·5 cites·15 claims
- 0579US8742553B2Printed wiring boardIBIDEN CO LTD·Filed 2012·Granted Jun 3, 2014·4 cites·20 claims
- 0675US10182518B2Shield cap and method for manufacturing the sameIBIDEN CO LTD·Filed 2017·Granted Jan 15, 2019·2 cites·20 claims
- 0771US10219383B2Printed wiring board and method for manufacturing the sameIBIDEN CO LTD·Filed 2018·Granted Feb 26, 2019·1 cites·15 claims
- 0870US9048229B2Printed wiring boardIBIDEN CO LTD·Filed 2014·Granted Jun 2, 2015·2 cites·20 claims
- 0968US10231336B2Printed wiring board for mounting electronic componentIBIDEN CO LTD·Filed 2018·Granted Mar 12, 2019·1 cites·20 claims
- 1066US8931168B2Method for manufacturing multilayer printed wiring boardHIBINO TOSHIAKI·Filed 2012·Granted Jan 13, 2015·2 cites·20 claims
- 1164US8692129B2Package-substrate-mounting printed wiring board and method for manufacturing the sameKASAI TOSHIAKI·Filed 2012·Granted Apr 8, 2014·3 cites·20 claims
- 1258US11882656B2Wiring substrate and method for manufacturing wiring substrateIBIDEN CO LTD·Filed 2022·Granted Jan 23, 2024·0 cites·20 claims
- 1355US12144121B2Wiring substrate and method for manufacturing wiring substrateIBIDEN CO LTD·Filed 2022·Granted Nov 12, 2024·0 cites·20 claims
- 1454US11792929B2Wiring substrate and method for manufacturing wiring substrateIBIDEN CO LTD·Filed 2022·Granted Oct 17, 2023·0 cites·20 claims
- 1551US11617262B2Wiring substrate and method for manufacturing wiring substrateIBIDEN CO LTD·Filed 2022·Granted Mar 28, 2023·0 cites·20 claims
- 1651US10194569B2Shield cap and method for manufacturing the sameIBIDEN CO LTD·Filed 2017·Granted Jan 29, 2019·0 cites·20 claims
- 1750US11996357B2Wiring substrate and method for manufacturing wiring substrateIBIDEN CO LTD·Filed 2021·Granted May 28, 2024·0 cites·20 claims
- 1850US9078366B2Printed wiring board and method for manufacturing the sameIBIDEN CO LTD·Filed 2013·Granted Jul 7, 2015·0 cites·20 claims
- 1945US10645819B2Printed wiring boardIBIDEN CO LTD·Filed 2018·Granted May 5, 2020·0 cites·20 claims
- 2045US2012247818A1Printed wiring boardADACHI TAKEMA·Filed 2012·Application pending·0 cites
- 2145US2015077963A1Printed wiring board with metal post and method for manufacturing printed wiring board with metal postIBIDEN CO LTD·Filed 2014·Application pending·0 cites
- 2245US2015062849A1Printed wiring boardIBIDEN CO LTD·Filed 2014·Application pending·0 cites
- 2343US10440823B2Printed wiring boardIBIDEN CO LTD·Filed 2019·Granted Oct 8, 2019·0 cites·20 claims
- 2443US10405426B2Printed wiring boardIBIDEN CO LTD·Filed 2018·Granted Sep 3, 2019·0 cites·20 claims
- 2543US10375828B2Printed wiring boardIBIDEN CO LTD·Filed 2018·Granted Aug 6, 2019·0 cites·20 claims
- 2643US10368440B2Printed wiring boardIBIDEN CO LTD·Filed 2018·Granted Jul 30, 2019·0 cites·20 claims
- 2743US10314168B2Printed wiring boardIBIDEN CO LTD·Filed 2018·Granted Jun 4, 2019·0 cites·20 claims
- 2841US10231369B2Shield cap and method for manufacturing the sameIBIDEN CO LTD·Filed 2017·Granted Mar 12, 2019·0 cites·20 claims
- 2939US10271468B2Shield cap and method for manufacturing the sameIBIDEN CO LTD·Filed 2017·Granted Apr 23, 2019·0 cites·20 claims
- 3039US2012229990A1Multilayer printed wiring board and method for manufacturing multilayer printed wiring boardADACHI TAKEMA·Filed 2012·Application pending·0 cites
- 3139US2012199386A1Multilayer printed wiring boardADACHI TAKEMA·Filed 2011·Application pending·0 cites
- 3238US10477699B2Method for manufacturing electronic component attached wiring boardIBIDEN CO LTD·Filed 2017·Granted Nov 12, 2019·0 cites·20 claims
- 3338US10070523B2Printed wiring board with conductor post having multiple surface roughness and method for manufacturing the sameIBIDEN CO LTD·Filed 2016·Granted Sep 4, 2018·0 cites·20 claims
- 3438US9980371B2Printed wiring boardIBIDEN CO LTD·Filed 2016·Granted May 22, 2018·0 cites·20 claims
- 3538US9837345B2Interposer and circuit substrateIBIDEN CO LTD·Filed 2016·Granted Dec 5, 2017·0 cites·20 claims
- 3638US2016295692A1Printed wiring board and method for manufacturing the sameIBIDEN CO LTD·Filed 2016·Application pending·0 cites
- 3735US9401320B2Combined substrateIBIDEN CO LTD·Filed 2015·Granted Jul 26, 2016·0 cites·20 claims
- 3835US2017053878A1Printed wiring board and semiconductor packageIBIDEN CO LTD·Filed 2016·Application pending·0 cites
- 3934US2017033036A1Printed wiring board, semiconductor package, and method for manufacturing printed wiring boardIBIDEN CO LTD·Filed 2016·Application pending·0 cites
- 4033US2016014898A1Printed wiring boardIBIDEN CO LTD·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →