Inventor · disambiguated record
Tatsuhiko Akiyama
Also filed as: AKIYAMA TATSUHIKO
14 granted patents·480 citations·filing 1987–2018
92Inventor score
Top patents by PatentIndex Score
14 records- 0195US4942454AResin sealed semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 1988·Granted Jul 17, 1990·257 cites·3 claims
- 0294US6545366B2Multiple chip package semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2001·Granted Apr 8, 2003·114 cites·12 claims
- 0385US8652880B2Semiconductor device and method of manufacturing sameBANDO KOJI·Filed 2012·Granted Feb 18, 2014·8 cites·3 claims
- 0482US8258604B2Semiconductor device and method of manufacturing sameBANDO KOJI·Filed 2009·Granted Sep 4, 2012·10 cites·11 claims
- 0573US4884124AResin-encapsulated semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 1987·Granted Nov 28, 1989·44 cites·8 claims
- 0669US10676365B2Hydrogenated silane compositionNIPPON CATALYTIC CHEM IND·Filed 2018·Granted Jun 9, 2020·0 cites·8 claims
- 0765US6583511B2Semiconductor device and a method of producing the sameMITSUBISHI ELECTRIC CORP·Filed 2001·Granted Jun 24, 2003·13 cites·2 claims
- 0864US9764961B2CyclohexasilaneNIPPON CATALYTIC CHEM IND·Filed 2017·Granted Sep 19, 2017·0 cites·8 claims
- 0962US9617161B2Method for producing cyclohexasilaneNIPPON CATALYTIC CHEM IND·Filed 2013·Granted Apr 11, 2017·0 cites·5 claims
- 1057US8124425B2Method for manufacturing magnetic memory chip deviceMISUMI KAZUYUKI·Filed 2008·Granted Feb 28, 2012·1 cites·2 claims
- 1153US10676366B2Hydrogenated silane compositionNIPPON CATALYTIC CHEM IND·Filed 2018·Granted Jun 9, 2020·0 cites·16 claims
- 1251US5659199AResin sealed semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 1996·Granted Aug 19, 1997·17 cites·8 claims
- 1348US8524510B2Method for manufacturing magnetic memory chip deviceMISUMI KAZUYUKI·Filed 2012·Granted Sep 3, 2013·0 cites·5 claims
- 1448US6255719B1Semiconductor device including thermal neutron absorption materialMITSUBISHI ELECTRIC CORP·Filed 1998·Granted Jul 3, 2001·16 cites·14 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →