Inventor · disambiguated record
Takayoshi Andou
Also filed as: ANDOU TAKAYOSHI
4 granted patents·1 pending application·24 citations·filing 2000–2015
68Inventor score
Top patents by PatentIndex Score
5 records- 0172US6400026B1Semiconductor device with the copper containing aluminum alloy bond pad on an active regionNEC CORP·Filed 2000·Granted Jun 4, 2002·21 cites·13 claims
- 0269US8981424B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2012·Granted Mar 17, 2015·3 cites·10 claims
- 0343US9136262B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2015·Granted Sep 15, 2015·0 cites·6 claims
- 0443US7867857B2Transistor and method for manufacturing sameRENESAS ELECTRONICS CORP·Filed 2007·Granted Jan 11, 2011·0 cites·14 claims
- 0538US2010006929A1Semiconductor device and method of manufacturing the sameNEC ELECTRONICS CORP·Filed 2009·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Takayoshi Andou files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →