Inventor · disambiguated record
Tatyana N. Andryushchenko
Also filed as: ANDRYUSHCHENKO TATYANA · ANDRYUSHCHENKO TATYANA N
8 granted patents·5 pending applications·63 citations·filing 2002–2015
84Inventor score
Top patents by PatentIndex Score
13 records- 0194US9391019B2Scalable interconnect structures with selective via postsINTEL CORP·Filed 2014·Granted Jul 12, 2016·26 cites·19 claims
- 0287US7585760B2Method for forming planarizing copper in a low-k dielectricINTEL CORP·Filed 2006·Granted Sep 8, 2009·14 cites·20 claims
- 0378US7223685B2Damascene fabrication with electrochemical layer removalINTEL CORP·Filed 2003·Granted May 29, 2007·10 cites·33 claims
- 0474US10204855B2Bendable and stretchable electronic devices and methodsINTEL CORP·Filed 2014·Granted Feb 12, 2019·3 cites·5 claims
- 0561US10468357B2Stretchable electronics fabrication method with strain redistribution layerINTEL CORP·Filed 2015·Granted Nov 5, 2019·1 cites·21 claims
- 0655US6790336B2Method of fabricating damascene structures in mechanically weak interlayer dielectricsINTEL CORP·Filed 2002·Granted Sep 14, 2004·9 cites·20 claims
- 0748US2004256224A1Damascene fabrication with electrochemical layer removalFiled 2003·Application pending·0 cites
- 0847US2007228011A1Novel chemical composition to reduce defectsBUEHLER MARK F·Filed 2006·Application pending·0 cites
- 0945US7560380B2Chemical dissolution of barrier and adhesion layersINTEL CORP·Filed 2006·Granted Jul 14, 2009·0 cites·23 claims
- 1040US2008213995A1Ultrasonic electropolishing of conductive materialANDRYUSHCHENKO TATYANA N·Filed 2007·Application pending·0 cites
- 1139US10206277B2Gradient encapsulant protection of devices in stretchable electronicsINTEL CORP·Filed 2015·Granted Feb 12, 2019·0 cites·15 claims
- 1238US2007298607A1Method for copper damascence fill for forming an interconnectANDRYUSHCHENKO TATYANA N·Filed 2006·Application pending·0 cites
- 1336US2007152252A1Reducing aluminum dissolution in high pH solutionsBUEHLER MARK F·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →