Inventor · disambiguated record
Takayuki Aoki
Also filed as: AOKI TAKAYUKI
71 granted patents·11 pending applications·823 citations·filing 1985–2024
99Inventor score
Files withSHINETSU CHEMICAL CO26TOYOTA MOTOR CO LTD11AOKI TAKAYUKI6MASUDA TOSHIAKI4TOKAI RIKA CO LTD4
Top patents by PatentIndex Score
82 records- 0198US10843628B2Onboard display device, control method for onboard display device, and control program for onboard display deviceTOYOTA MOTOR CO LTD·Filed 2018·Granted Nov 24, 2020·43 cites·17 claims
- 0287US11878731B2Switch deviceTOKAI RIKA CO LTD·Filed 2021·Granted Jan 23, 2024·2 cites·6 claims
- 0386US11673597B2Switch deviceTOKAI RIKA CO LTD·Filed 2021·Granted Jun 13, 2023·2 cites·5 claims
- 0486US8486531B2Thermally expanded microspheres and a process for producing the sameMASUDA TOSHIAKI·Filed 2012·Granted Jul 16, 2013·5 cites·8 claims
- 0585US8210133B2Engine-driven power generator apparatusHIROSE TADAFUMI·Filed 2009·Granted Jul 3, 2012·18 cites·6 claims
- 0684US10222613B2Display apparatus for a vehicleTOYOTA MOTOR CO LTD·Filed 2017·Granted Mar 5, 2019·5 cites·8 claims
- 0783US8328207B2Engine generatorHIROSE TADAFUMI·Filed 2009·Granted Dec 11, 2012·14 cites·4 claims
- 0882US5336786AOrganic silicon compoundsSHINETSU CHEMICAL CO·Filed 1993·Granted Aug 9, 1994·24 cites·6 claims
- 0981US9711807B2Fuel cell module with heat exchangerHONDA MOTOR CO LTD·Filed 2013·Granted Jul 18, 2017·3 cites·8 claims
- 1080US10340825B2Motor driving device, method, and programRENESAS ELECTRONICS CORP·Filed 2018·Granted Jul 2, 2019·2 cites·12 claims
- 1179US5298548AEpoxy resin composition and semiconductor devices encapsulated therewithSHINETSU CHEMICAL CO·Filed 1992·Granted Mar 29, 1994·33 cites·15 claims
- 1276US8899200B2Valve spring retainer for an internal combustion engine and a method of manufacturing the sameAOKI TAKAYUKI·Filed 2010·Granted Dec 2, 2014·3 cites·3 claims
- 1376US6177489B1Semiconductor encapsulating epoxy resin composition and semiconductor deviceSHINETSU CHEMICAL CO·Filed 1998·Granted Jan 23, 2001·53 cites·11 claims
- 1475US5329597ADevice and method for measuring angles of a workAMADA CO LTD·Filed 1991·Granted Jul 12, 1994·37 cites·22 claims
- 1574US6630745B1Semiconductor encapsulating epoxy resin composition and semiconductor deviceSHINETSU CHEMICAL CO·Filed 2000·Granted Oct 7, 2003·18 cites·9 claims
- 1674US5422075AChemical luminescence-detecting apparatus with multiple sensorsSANKYO CO·Filed 1993·Granted Jun 6, 1995·43 cites·7 claims
- 1771US7095125B2Semiconductor encapsulating epoxy resin composition and semiconductor deviceSHINETSU CHEMICAL CO·Filed 2003·Granted Aug 22, 2006·15 cites·9 claims
- 1871US6500564B1Semiconductor encapsulating epoxy resin composition and semiconductor deviceSHINETSU CHEMICAL CO·Filed 2000·Granted Dec 31, 2002·17 cites·11 claims
- 1970US7930092B2Control apparatus for internal combustion engineKEIHIN CORP·Filed 2008·Granted Apr 19, 2011·7 cites·14 claims
- 2070US5225484AEpoxy resin compositions and cured products thereofSHINETSU CHEMICAL CO·Filed 1991·Granted Jul 6, 1993·16 cites·11 claims
- 2168US7943706B2Semiconductor encapsulating epoxy resin composition and semiconductor deviceSHINETSU CHEMICAL CO·Filed 2006·Granted May 17, 2011·4 cites·4 claims
- 2267US9296409B2Vehicle steering column support structureAOKI TAKAYUKI·Filed 2010·Granted Mar 29, 2016·5 cites·10 claims
- 2367US9227671B2Vehicle instrument panel reinforcementAOKI TAKAYUKI·Filed 2011·Granted Jan 5, 2016·5 cites·6 claims
- 2467US8754141B2Heat-expandable microspheres and a process for producing the sameMATSUMOTO YUSHI SEIYAKU KK·Filed 2012·Granted Jun 17, 2014·2 cites·4 claims
- 2566US12434564B2Vehicle display control deviceTOYOTA MOTOR CO LTD·Filed 2023·Granted Oct 7, 2025·0 cites·2 claims
- 2666US8324286B2Heat-expandable microspheres, method for producing the same, and application thereofMASUDA TOSHIAKI·Filed 2006·Granted Dec 4, 2012·2 cites·5 claims
- 2764US11875530B2Image display system and image controllerTOYOTA MOTOR CO LTD·Filed 2022·Granted Jan 16, 2024·0 cites·11 claims
- 2864US5668440ANitride layer for discharge lampsTOSHIBA LIGHTING & TECHNOLOGY·Filed 1995·Granted Sep 16, 1997·19 cites·11 claims
- 2964US5166228AEpoxy resin compositions containing polysubstituted novolac epoxy resins and naphthylene based phenolic resin curing agents and semiconductor devices encapsulated therewithSHINETSU CHEMICAL CO·Filed 1991·Granted Nov 24, 1992·18 cites·8 claims
- 3063US5739187ASemiconductor encapsulating epoxy resin compositions and semiconductor devices encapsulated therewithSHINETSU CHEMICAL CO·Filed 1996·Granted Apr 14, 1998·30 cites·9 claims
- 3162US11747628B2AR glassesTOYOTA MOTOR CO LTD·Filed 2022·Granted Sep 5, 2023·0 cites·9 claims
- 3262US5366567AMethod for chromating treatment of zinc coated steelHENKEL CORP·Filed 1991·Granted Nov 22, 1994·25 cites·20 claims
- 3362US5140175ALight-emitting diode drive circuit with fast rise time and fall timeMITSUBISHI RAYON CO·Filed 1990·Granted Aug 18, 1992·27 cites·6 claims
- 3461US12288354B2Vehicle control deviceTOYOTA MOTOR CO LTD·Filed 2024·Granted Apr 29, 2025·0 cites·5 claims
- 3559US6723452B2Semiconductor encapsulating epoxy resin composition and semiconductor deviceSHINETSU CHEMICAL CO·Filed 2002·Granted Apr 20, 2004·9 cites·16 claims
- 3658US6221509B1Semiconductor encapsulating epoxy resin compositions, and semiconductor devices encapsulated therewithTATSUMORI LTD·Filed 1999·Granted Apr 24, 2001·26 cites·14 claims
- 3758US5312878ANaphthalene containing epoxy resin cured with a dicyclopentadiene phenolic resinSHINETSU CHEMICAL CO·Filed 1992·Granted May 17, 1994·19 cites·20 claims
- 3857US12307708B2Vehicle control deviceTOYOTA MOTOR CO LTD·Filed 2023·Granted May 20, 2025·0 cites·5 claims
- 3957US12030426B2Lever operation deviceTOKAI RIKA CO LTD·Filed 2022·Granted Jul 9, 2024·0 cites·9 claims
- 4056US11815695B2Image display systemTOYOTA MOTOR CO LTD·Filed 2022·Granted Nov 14, 2023·0 cites·6 claims
- 4156US8329298B2Heat-expandable microspheres and a process for producing the sameMASUDA TOSHIAKI·Filed 2006·Granted Dec 11, 2012·1 cites·3 claims
- 4256US8129020B2Thermally expanded microspheres and a process for producing the sameMASUDA TOSHIAKI·Filed 2006·Granted Mar 6, 2012·1 cites·15 claims
- 4356US6342309B1Epoxy resin composition and semiconductor deviceSHINETSU CHEMICAL CO·Filed 2000·Granted Jan 29, 2002·7 cites·4 claims
- 4456US6162878ASemiconductor encapsulating epoxy resin composition and semiconductor deviceSHINETSU CHEMICAL CO·Filed 1999·Granted Dec 19, 2000·21 cites·13 claims
- 4556US5418266AEpoxy resin compositions and semiconductor devices encapsulated therewithSHINETSU CHEMICAL CO·Filed 1994·Granted May 23, 1995·24 cites·10 claims
- 4656US2024343876A1Heat-expandable microspheres, composition, and formed productMATSUMOTO YUSHI SEIYAKU KK·Filed 2022·Application pending·0 cites
- 4755US2023250242A1Masterbatch for foam molding and application thereofMATSUMOTO YUSHI SEIYAKU KK·Filed 2021·Application pending·0 cites
- 4854US8814206B2Vehicle instrument panel reinforcement and passenger seat airbag device attachment structure employing the vehicle instrument panel reinforcementAOKI TAKAYUKI·Filed 2011·Granted Aug 26, 2014·1 cites·6 claims
- 4954US6143423AFlame retardant epoxy resin compositionsSHINETSU CHEMICAL CO·Filed 1998·Granted Nov 7, 2000·21 cites·20 claims
- 5054US5994823AHigh-pressure discharge lamp, turning-on circuit device, and lighting fixtureTOSHIBA LIGHTING & TECHNOLOGY·Filed 1996·Granted Nov 30, 1999·11 cites·10 claims
Showing the top 50 of 82 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →