Inventor · disambiguated record
Tatsuhiko Asai
Also filed as: ASAI TATSUHIKO
9 granted patents·1 pending application·5 citations·filing 2017–2022
77Inventor score
Technology areasH10W
Files withFUJI ELECTRIC CO LTD10
Top patents by PatentIndex Score
10 records- 0189US11581252B2Semiconductor module and wire bonding methodFUJI ELECTRIC CO LTD·Filed 2021·Granted Feb 14, 2023·2 cites·8 claims
- 0272US10128345B2Semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2017·Granted Nov 13, 2018·2 cites·13 claims
- 0363US10373919B2Semiconductor device and method of manufacturing semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2017·Granted Aug 6, 2019·1 cites·6 claims
- 0452US11380599B2Semiconductor module, vehicle, and method of manufacturing semiconductor moduleFUJI ELECTRIC CO LTD·Filed 2020·Granted Jul 5, 2022·0 cites·13 claims
- 0550US12127382B2Semiconductor module with cooling fins in a matrix formFUJI ELECTRIC CO LTD·Filed 2022·Granted Oct 22, 2024·0 cites·14 claims
- 0649US2022278039A1Semiconductor module and method for manufacturing semiconductor moduleFUJI ELECTRIC CO LTD·Filed 2022·Application pending·0 cites
- 0748US11935813B2Semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2021·Granted Mar 19, 2024·0 cites·18 claims
- 0847US10916491B2Semiconductor moduleFUJI ELECTRIC CO LTD·Filed 2018·Granted Feb 9, 2021·0 cites·15 claims
- 0945US10256169B2Semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2017·Granted Apr 9, 2019·0 cites·20 claims
- 1040US10910324B2Semiconductor device having a resin case with a notch grooveFUJI ELECTRIC CO LTD·Filed 2017·Granted Feb 2, 2021·0 cites·12 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →