Inventor · disambiguated record
Tatsuo Asakawa
Also filed as: ASAKAWA Tatsuo
8 granted patents·10 citations·filing 2013–2020
79Inventor score
Files withHOYA CORP8
Top patents by PatentIndex Score
8 records- 0189US9377679B2Reflective mask blank and method for manufacturing same, method for manufacturing reflective mask, and method for manufacturing semiconductor deviceHOYA CORP·Filed 2013·Granted Jun 28, 2016·5 cites·19 claims
- 0278US9720315B2Reflective mask blank, method of manufacturing reflective mask blank, reflective mask and method of manufacturing semiconductor deviceHOYA CORP·Filed 2014·Granted Aug 1, 2017·2 cites·18 claims
- 0376US9726969B2Reflective mask blank, method of manufacturing same, reflective mask and method of manufacturing semiconductor deviceHOYA CORP·Filed 2014·Granted Aug 8, 2017·2 cites·18 claims
- 0474US10606166B2Substrate with electrically conductive film, substrate with multilayer reflective film, reflective mask blank, reflective mask, and method of manufacturing semiconductor deviceHOYA CORP·Filed 2016·Granted Mar 31, 2020·1 cites·20 claims
- 0569US10996554B2Substrate with an electrically conductive film, substrate with a multilayer reflective film, reflective mask blank, reflective mask and method of manufacturing semiconductor deviceHOYA CORP·Filed 2020·Granted May 4, 2021·0 cites·21 claims
- 0659US10191365B2Reflective mask blank, method of manufacturing reflective mask blank, reflective mask and method of manufacturing semiconductor deviceHOYA CORP·Filed 2017·Granted Jan 29, 2019·0 cites·20 claims
- 0756US9535318B2Reflective mask blank and method for manufacturing same, method for manufacturing reflective mask, and method for manufacturing semiconductor deviceHOYA CORP·Filed 2016·Granted Jan 3, 2017·0 cites·9 claims
- 0842US10347485B2Reflective mask blank, method for manufacturing same, reflective mask, method for manufacturing same, and method for manufacturing semiconductor deviceHOYA CORP·Filed 2015·Granted Jul 9, 2019·0 cites·34 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →