Inventor · disambiguated record
Tai-Min Chang
Also filed as: CHANG TAI MIN
20 granted patents·11 pending applications·20 citations·filing 2012–2025
91Inventor score
Top patents by PatentIndex Score
31 records- 0198US11508633B2Package structure having taper-shaped conductive pillar and method of forming thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 22, 2022·7 cites·20 claims
- 0296US11990383B2Package structure having at least one die with a plurality of taper-shaped die connectorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted May 21, 2024·2 cites·20 claims
- 0396US11789366B2Method for removing resist layer, and method of manufacturing semiconductorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Oct 17, 2023·2 cites·20 claims
- 0492US11378886B2Method for removing resist layer, and method of manufacturing semiconductorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jul 5, 2022·2 cites·20 claims
- 0592US2025364340A1Package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0691US11515276B2Integrated circuit, package structure, and manufacturing method of package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 29, 2022·2 cites·20 claims
- 0789US2025349639A1Packages with enlarged through-vias in encapsulantTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0886US12469757B2Package structure including a die having a taper-shaped die connectorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Nov 11, 2025·0 cites·20 claims
- 0984US2025060676A1Method for removing resistor layer, and method of manufacturing semiconductorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1083US12164232B2Method for removing resistor layer, and method of manufacturing semiconductorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Dec 10, 2024·0 cites·20 claims
- 1182US12431400B2Packages with enlarged through-vias in encapsulantTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Sep 30, 2025·0 cites·20 claims
- 1282US2025349605A1Semiconductor devices and methods of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1380US10522501B2Semiconductor structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 31, 2019·2 cites·20 claims
- 1480US2025029946A1Package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1578US12132023B2Integrated circuit, package structure, and manufacturing method of package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Oct 29, 2024·0 cites·20 claims
- 1678US11289373B2Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Mar 29, 2022·2 cites·20 claims
- 1777US11823969B2Packages with enlarged through-vias in encapsulantTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Nov 21, 2023·0 cites·20 claims
- 1875US2024404876A1Semiconductor devices and methods of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1974US11587902B2Semiconductor structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Feb 21, 2023·1 cites·20 claims
- 2074US2025300125A1Semiconductor structure having a conductive feature comprising an adhesion layer and a metal region over and contacting the adhesion layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2172US12381176B2Semiconductor structure having a conductive feature comprising an adhesion layer and a metal region over and contacting the adhesion layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Aug 5, 2025·0 cites·20 claims
- 2271US2024379423A1Barrier layer for an interconnect structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2369US11848233B2Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 19, 2023·0 cites·20 claims
- 2469US11515224B2Packages with enlarged through-vias in encapsulantTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 29, 2022·0 cites·20 claims
- 2565US2023036693A1Semiconductor Devices and Methods of ManufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 2662US11742317B2Process including a re-etching process for forming a semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 29, 2023·0 cites·20 claims
- 2755US12439625B2Semiconductor device structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Oct 7, 2025·0 cites·20 claims
- 2855US2025233074A1Methods for selective metal cap formationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2952US10978412B2Manufacturing method of package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Apr 13, 2021·0 cites·20 claims
- 3048US2023137108A1Semiconductor interconnect structures and methods of formationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 3132US8796071B2Thermal dissipation substrateWU YEWCHUNG SERMON·Filed 2012·Granted Aug 5, 2014·0 cites·16 claims
Join the waitlist — get patent alerts
Get an alert when Tai-Min Chang files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →