Inventor · disambiguated record
Tang-Kuei Chang
Also filed as: CHANG TANG-KUEI
15 granted patents·13 pending applications·13 citations·filing 2006–2025
87Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD25CHANG TANG-KUEI1NENG TYI PREC IND CO LTD1TAIWAN SEMICONDUCTOR MFG1
Top patents by PatentIndex Score
28 records- 0186US10643892B2Metal loss prevention using implantationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted May 5, 2020·3 cites·20 claims
- 0285US11211289B2Metal loss prevention using implantationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 28, 2021·2 cites·20 claims
- 0383US12068195B2Metal loss prevention using implantationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Aug 20, 2024·0 cites·20 claims
- 0478US2025357100A1Processing tool and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0577US11710659B2Metal loss prevention using implantationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jul 25, 2023·0 cites·20 claims
- 0676US12002684B2Methods for chemical mechanical polishing and forming interconnect structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jun 4, 2024·0 cites·20 claims
- 0776US2024290629A1Methods for chemical mechanical polishing and forming interconnect structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0874US9339912B2Wafer polishing tool using abrasive tapeTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted May 17, 2016·2 cites·20 claims
- 0974US2024363404A1Ion implant process for defect elimination in metal layer planarizationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1073US9931726B2Wafer edge trimming tool using abrasive tapeTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Apr 3, 2018·2 cites·20 claims
- 1171US2025312886A1Device and method for improved cmp process with cmp headTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1270US2025312891A1Chemical mechanical polishing system with conditioning ringTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1370US2025353140A1Polishing apparatusTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1470US2025367786A1Cmp method and system with nanobubble cleaningTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1567US11532514B2Structure and formation method of semiconductor device with conductive featureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 20, 2022·0 cites·20 claims
- 1667US11508585B2Methods for chemical mechanical polishing and forming interconnect structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 22, 2022·0 cites·20 claims
- 1766US7423879B2Sleeve-tightening heat dissipating moduleNENG TYI PREC IND CO LTD·Filed 2006·Granted Sep 9, 2008·4 cites·4 claims
- 1866US2022359277A1Ion implant process for defect elimination in metal layer planarizationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 1963US2025303329A1Filter with metal-organic framework for cmp processingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2059US2025372435A1System and method for cleaning a wafer surfaceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2158US10957587B2Structure and formation method of semiconductor device with conductive featureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Mar 23, 2021·0 cites·20 claims
- 2258US2025349562A1Apparatus and methods for chemical mechanical polishingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2357US11658065B2Chemical mechanical polishing slurry composition, method for chemical mechanical polishing and method for forming connecting structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 23, 2023·0 cites·20 claims
- 2456US12297375B2Slurry composition and method for polishing and integrated circuitTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted May 13, 2025·0 cites·20 claims
- 2555US11450565B2Ion implant process for defect elimination in metal layer planarizationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Sep 20, 2022·0 cites·20 claims
- 2655US2024420978A1Retaining ring for chemical-mechanical polishingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 2749US9829806B2Lithography tool with backside polisherTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Nov 28, 2017·0 cites·21 claims
- 2841US2011277969A1Heat dissipation device which is pre-built with an air vent structureCHANG TANG-KUEI·Filed 2007·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →