Inventor · disambiguated record
Tanawan Chaowasakoo
Also filed as: CHAOWASAKOO TANAWAN
2 granted patents·1 pending application·2 citations·filing 2019–2021
39Inventor score
Technology areasH10W
Files withUTAC HEADQUARTERS PTE LTD3
Top patents by PatentIndex Score
3 records- 0170US11145575B2Conductive bonding layer with spacers between a package substrate and chipUTAC HEADQUARTERS PTE LTD·Filed 2019·Granted Oct 12, 2021·2 cites·14 claims
- 0256US11710681B2Semiconductor packages and methods of packaging semiconductor devicesUTAC HEADQUARTERS PTE LTD·Filed 2021·Granted Jul 25, 2023·0 cites·20 claims
- 0338US2021202339A1Reliable semiconductor packagesUTAC HEADQUARTERS PTE LTD·Filed 2020·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →