Inventor · disambiguated record
Tai-Yu Chen
Also filed as: CHEN TAI-YU
88 granted patents·34 pending applications·103 citations·filing 2004–2025
98Inventor score
Files withMEDIATEK INC45KYOCERA DOCUMENT SOLUTIONS INC39TAIWAN SEMICONDUCTOR MFG CO LTD24PIONEER MATERIAL PREC TECH CO LTD4MEDIATEK SINGAPORE PTE LTD2
Top patents by PatentIndex Score
122 records- 0197US11227846B2Semiconductor package having improved thermal interface between semiconductor die and heat spreading structureMEDIATEK INC·Filed 2020·Granted Jan 18, 2022·7 cites·14 claims
- 0296US12019378B2Methods of cleaning a lithography systemTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jun 25, 2024·2 cites·20 claims
- 0396US11392040B2System and method for performing extreme ultraviolet photolithography processesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jul 19, 2022·4 cites·20 claims
- 0496US10942067B2Method and apparatus for surface and ambient temperature estimation for portable devicesMEDIATEK INC·Filed 2020·Granted Mar 9, 2021·6 cites·20 claims
- 0594US11768437B2System and method for performing extreme ultraviolet photolithography processesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Sep 26, 2023·2 cites·20 claims
- 0694US11662668B2Lithography contamination controlTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted May 30, 2023·2 cites·20 claims
- 0792US12078933B2System and method for omnidirectional real time detection of photolithography characteristicsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Sep 3, 2024·2 cites·20 claims
- 0891US10573579B2Semiconductor package with improved heat dissipationMEDIATEK INC·Filed 2018·Granted Feb 25, 2020·10 cites·17 claims
- 0991US10109608B2Semiconductor packageMEDIATEK INC·Filed 2016·Granted Oct 23, 2018·7 cites·19 claims
- 1090US12087664B2Semiconductor package having liquid-cooling lidMEDIATEK INC·Filed 2023·Granted Sep 10, 2024·1 cites·7 claims
- 1190US9837595B2Semiconductor package assembly with thermal recycling functionMEDIATEK INC·Filed 2015·Granted Dec 5, 2017·8 cites·18 claims
- 1288US12372887B2Methods of cleaning a lithography systemTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Jul 29, 2025·0 cites·20 claims
- 1388US11822259B2Acoustic particle deflection in lithography toolTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Nov 21, 2023·1 cites·20 claims
- 1488US11640930B2Semiconductor package having liquid-cooling lidMEDIATEK INC·Filed 2020·Granted May 2, 2023·2 cites·14 claims
- 1586US9607951B2Chip packageMEDIATEK SINGAPORE PTE LTD·Filed 2013·Granted Mar 28, 2017·8 cites·16 claims
- 1686US9521246B2Thermal control method and thermal control systemMEDIATEK INC·Filed 2015·Granted Dec 13, 2016·6 cites·23 claims
- 1786US9000581B2Semiconductor packageMEDIATEK INC·Filed 2013·Granted Apr 7, 2015·7 cites·19 claims
- 1885US11647578B2Lithography thermal controlTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted May 9, 2023·1 cites·20 claims
- 1985US11621211B2Semiconductor package structureMEDIATEK INC·Filed 2020·Granted Apr 4, 2023·2 cites·20 claims
- 2085US11302592B2Semiconductor package having a stiffener ringMEDIATEK INC·Filed 2018·Granted Apr 12, 2022·4 cites·16 claims
- 2184US2025321492A1Semiconductor processing tool and methods of operationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2283US12085860B2System and method for monitoring and controlling extreme ultraviolet photolithography processesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Sep 10, 2024·1 cites·23 claims
- 2382US12422755B2Semiconductor processing tool and methods of operationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Sep 23, 2025·0 cites·20 claims
- 2482US2025321505A1Acoustic particle deflection in lithography toolTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2581US2025354920A1Inspection system with multiwavelength light source and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2680US11302657B2Semiconductor package having improved thermal interface between semiconductor die and heat spreading structureMEDIATEK INC·Filed 2020·Granted Apr 12, 2022·1 cites·9 claims
- 2778US12372886B2Acoustic particle deflection in lithography toolTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jul 29, 2025·0 cites·20 claims
- 2878US12096544B2Lithography thermal controlTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Sep 17, 2024·0 cites·20 claims
- 2978US9534612B2Control method and control system of fanDELTA ELECTRONICS INC·Filed 2013·Granted Jan 3, 2017·5 cites·13 claims
- 3077US12055867B2Lithography contamination controlTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Aug 6, 2024·0 cites·20 claims
- 3177US2025377649A1Integrated circuit configurable to perform adaptive thermal ceiling control in per-functional-block manner, associated main circuit, associated electronic device and associated thermal control methodMEDIATEK INC·Filed 2025·Application pending·0 cites
- 3276US2024389215A1Lithography thermal controlTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3375US11967570B2Semiconductor package having improved thermal interface between semiconductor die and heat spreading structureMEDIATEK INC·Filed 2022·Granted Apr 23, 2024·0 cites·12 claims
- 3475US9280188B2Thermal control method and thermal control systemMEDIATEK INC·Filed 2014·Granted Mar 8, 2016·4 cites·20 claims
- 3573US12174545B2System and method for performing extreme ultraviolet photolithography processesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Dec 24, 2024·0 cites·20 claims
- 3673US11852978B2EUV lithography system with 3D sensing and tunning modulesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 26, 2023·0 cites·20 claims
- 3773US11705413B2Semiconductor package having improved thermal interface between semiconductor die and heat spreading structureMEDIATEK INC·Filed 2021·Granted Jul 18, 2023·0 cites·12 claims
- 3873US2025085215A1Inspection system with multiwavelength light source and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3973US2024377752A1System and method for monitoring and controlling extreme ultraviolet photolithography processesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 4072US11906902B2Semiconductor processing tool and methods of operationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Feb 20, 2024·0 cites·20 claims
- 4172US11507331B2Policy-based printing system and methods using list for documentsKYOCERA DOCUMENT SOLUTIONS INC·Filed 2022·Granted Nov 22, 2022·0 cites·20 claims
- 4272US10340199B2Packaging substrate with block-type via and semiconductor packages having the sameMEDIATEK INC·Filed 2015·Granted Jul 2, 2019·2 cites·20 claims
- 4371US11513749B2Policy-based printing system and methods using a mobile deviceKYOCERA DOCUMENT SOLUTIONS INC·Filed 2021·Granted Nov 29, 2022·0 cites·12 claims
- 4471US11513746B2Policy-based printing system and methods using list for documentsKYOCERA DOCUMENT SOLUTIONS INC·Filed 2022·Granted Nov 29, 2022·0 cites·20 claims
- 4571US10739206B2Method and apparatus for surface and ambient temperature estimation for portable devicesMEDIATEK INC·Filed 2017·Granted Aug 11, 2020·1 cites·20 claims
- 4669US12411474B2Integrated circuit configurable to perform adaptive thermal ceiling control in per-functional-block manner, associated main circuit, associated electronic device and associated thermal control methodMEDIATEK INC·Filed 2022·Granted Sep 9, 2025·0 cites·26 claims
- 4769US11556292B2Private server implementation of policy for printing system having an overage statusKYOCERA DOCUMENT SOLUTIONS INC·Filed 2021·Granted Jan 17, 2023·0 cites·6 claims
- 4869US11544023B2Methods for printing using an off-line policy-based printing systemKYOCERA DOCUMENT SOLUTIONS INC·Filed 2021·Granted Jan 3, 2023·0 cites·7 claims
- 4969US11544021B2Private server implementation of policy for carryover and borrowing usageKYOCERA DOCUMENT SOLUTIONS INC·Filed 2021·Granted Jan 3, 2023·0 cites·7 claims
- 5069US11544024B2Methods and system for policy-based printing using public print serverKYOCERA DOCUMENT SOLUTIONS INC·Filed 2022·Granted Jan 3, 2023·0 cites·20 claims
Showing the top 50 of 122 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →