Inventor · disambiguated record
Tai-Yu Chou
Also filed as: CHOU TAI-YU
4 granted patents·2 pending applications·305 citations·filing 1996–2023
80Inventor score
Files withLSI LOGIC CORP2EXPRESS PACKAGING SYSTEMS INC1FULIAN YUZHAN PRECISION TECH CO LTD1SUN MICROSYSTEMS INC1UNIV NAT TAIWAN1
Top patents by PatentIndex Score
6 records- 0190US5825084ASingle-core two-side substrate with u-strip and co-planar signal traces, and power and ground planes through split-wrap-around (SWA) or split-via-connections (SVC) for packaging IC devicesEXPRESS PACKAGING SYSTEMS INC·Filed 1997·Granted Oct 20, 1998·117 cites·22 claims
- 0286US5691568AWire bondable package design with maxium electrical performance and minimum number of layersLSI LOGIC CORP·Filed 1996·Granted Nov 25, 1997·106 cites·21 claims
- 0382US5672911AApparatus to decouple core circuits power supply from input-output circuits power supply in a semiconductor device packageLSI LOGIC CORP·Filed 1996·Granted Sep 30, 1997·82 cites·21 claims
- 0458US2024157469A1Method for determining stability of welding equipment, welding equipment and determining deviceFULIAN YUZHAN PRECISION TECH CO LTD·Filed 2023·Application pending·0 cites
- 0542US2011077562A1Gait training deviceUNIV NAT TAIWAN·Filed 2010·Application pending·0 cites
- 0640US6519747B2Method and apparatus for defining signal timing for an integrated circuit deviceSUN MICROSYSTEMS INC·Filed 2001·Granted Feb 11, 2003·0 cites·21 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →