Inventor · disambiguated record
Takashi Egawa
Also filed as: EGAWA TAKASHI
11 granted patents·1 pending application·279 citations·filing 1986–2021
90Inventor score
Files withNGK INSULATORS LTD4NEC CORP2ADVICS CO LTD1ASAHI CHEMICAL IND1DOWA ELECTRONICS MATERIALS CO LTD1
Top patents by PatentIndex Score
12 records- 0193US5745694ANetwork resource reservation with admission and link control functions separated for expandability and high-speed operationNEC CORP·Filed 1995·Granted Apr 28, 1998·194 cites·23 claims
- 0288US8344356B2Semiconductor material, method of making the same, and semiconductor deviceDOWA ELECTRONICS MATERIALS CO LTD·Filed 2008·Granted Jan 1, 2013·16 cites·11 claims
- 0381US7825417B2Epitaxial wafers, method for manufacturing of epitaxial wafers, method of suppressing bowing of these epitaxial wafers and semiconductor multilayer structures using these epitaxial wafersNGK INSULATORS LTD·Filed 2008·Granted Nov 2, 2010·6 cites·24 claims
- 0466US8431271B2Positive active material for lithium secondary battery and lithium secondary batteryFUJINO YUKIKO·Filed 2009·Granted Apr 30, 2013·1 cites·4 claims
- 0558US7926268B2Master cylinderADVICS CO LTD·Filed 2008·Granted Apr 19, 2011·2 cites·7 claims
- 0654US6835965B2Semiconductor light-emitting devicesNGK INSULATORS LTD·Filed 2003·Granted Dec 28, 2004·4 cites·17 claims
- 0754US4713354AMethod of heat treatment for reduction of dislocation density near III-V substrate surfaceOKI ELECTRIC IND CO LTD·Filed 1986·Granted Dec 15, 1987·20 cites·4 claims
- 0851USD1054284SPackaging caseASAHI CHEMICAL IND·Filed 2021·Granted Dec 17, 2024·1 cites·1 claims
- 0951US6697863B1Method and packet-processing device for use in an active node included in an active network to allocate a sequence of packets received by the active nodeNEC CORP·Filed 1999·Granted Feb 24, 2004·31 cites·6 claims
- 1050US7479658B2Epitaxial wafers, method for manufacturing of epitaxial wafers, method of suppressing bowing of these epitaxial wafers and semiconductor multilayer structures using these epitaxial wafersNGK INSULATORS LTD·Filed 2004·Granted Jan 20, 2009·2 cites·5 claims
- 1149US7135347B2Method for manufacturing nitride film including high-resistivity GaN layer and epitaxial substrate manufactured by the methodNGK INSULATORS LTD·Filed 2004·Granted Nov 14, 2006·2 cites·12 claims
- 1242US2005271930A1Polymer electrolyte fuel cell and manufacturing method thereofJAPAN STORAGE BATTERY CO LTD·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →