Inventor · disambiguated record
Takemi Endoh
Also filed as: ENDOH TAKEMI
3 granted patents·169 citations·filing 1993–1995
77Inventor score
Files withMITSUBISHI ELECTRIC CORP3
Top patents by PatentIndex Score
3 records- 0185US5430329ASemiconductor device with bonding pad electrodeMITSUBISHI ELECTRIC CORP·Filed 1994·Granted Jul 4, 1995·78 cites·14 claims
- 0280US5525546ASemiconductor device and method of manufacturing thereofMITSUBISHI ELECTRIC CORP·Filed 1995·Granted Jun 11, 1996·59 cites·8 claims
- 0358US5306947ASemiconductor device and manufacturing method thereofMITSUBISHI ELECTRIC CORP·Filed 1993·Granted Apr 26, 1994·32 cites·7 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →