Inventor · disambiguated record
Tae Shin Eom
Also filed as: EOM TAE SHIN
3 granted patents·4 pending applications·0 citations·filing 2008–2025
40Inventor score
Top patents by PatentIndex Score
7 records- 0150US11655363B2Tableted epoxy resin composition for encapsulation of semiconductor device and semiconductor device encapsulated using the sameSAMSUNG SDI CO LTD·Filed 2019·Granted May 23, 2023·0 cites·20 claims
- 0248US2025289922A1Epoxy resin composition for encapsulating semiconductor device and semiconductor device encapsulated using the sameSAMSUNG SDI CO LTD·Filed 2025·Application pending·0 cites
- 0345US2009141472A1Adhesive composition for die bonding in semiconductor assembly, adhesive film prepared therefrom, device including the same, and associated methodsCHOI HAN NIM·Filed 2008·Application pending·0 cites
- 0444US2025236760A1Epoxy resin composition for encapsulating semiconductor device and semiconductor device encapsulated using the sameSAMSUNG SDI CO LTD·Filed 2025·Application pending·0 cites
- 0543US10793711B2Epoxy resin composition for sealing semiconductor device, and semiconductor device sealed using sameSAMSUNG SDI CO LTD·Filed 2017·Granted Oct 6, 2020·0 cites·11 claims
- 0642US11702537B2Tablet-type epoxy resin composition for sealing semiconductor device, and semiconductor device sealed using the sameSAMSUNG SDI CO LTD·Filed 2019·Granted Jul 18, 2023·0 cites·11 claims
- 0730US2016137808A1Epoxy resin composition for encapsulating semiconductor package and semiconductor package encapsulated using the sameSAMSUNG SDI CO LTD·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →