Inventor · disambiguated record
Taizo Eshima
Also filed as: ESHIMA TAIZO
5 granted patents·353 citations·filing 1988–1996
85Inventor score
Files withMITSUBISHI ELECTRIC CORP5
Top patents by PatentIndex Score
5 records- 0194US5534073ASemiconductor producing apparatus comprising wafer vacuum chucking deviceMITSUBISHI ELECTRIC CORP·Filed 1993·Granted Jul 9, 1996·213 cites·9 claims
- 0278US5976260ASemiconductor producing apparatus, and wafer vacuum chucking device, gas cleaning method and nitride film forming method in semiconductor producing apparatusMITSUBISHI ELECTRIC CORP·Filed 1996·Granted Nov 2, 1999·48 cites·14 claims
- 0377US5093281Amethod for manufacturing semiconductor devicesMITSUBISHI ELECTRIC CORP·Filed 1989·Granted Mar 3, 1992·52 cites·5 claims
- 0457US4923386AApparatus for forming leads of a semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 1988·Granted May 8, 1990·20 cites·4 claims
- 0547US4885837AApparatus for forming leads of semiconductor devicesMITSUBISHI ELECTRIC CORP·Filed 1988·Granted Dec 12, 1989·20 cites·14 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →