Inventor · disambiguated record
Takenori Fujiwara
Also filed as: FUJIWARA TAKENORI
9 granted patents·5 pending applications·22 citations·filing 2005–2022
78Inventor score
Top patents by PatentIndex Score
14 records- 0189US7374856B2Positive type photo-sensitive siloxane composition, cured film formed from the composition and device incorporating the cured filmTORAY INDUSTRIES·Filed 2005·Granted May 20, 2008·20 cites·20 claims
- 0266US9704724B2Photosensitive resin composition and method for producing semiconductor deviceTORAY INDUSTRIES·Filed 2012·Granted Jul 11, 2017·2 cites·14 claims
- 0353US10941320B2Adhesive for temporary bonding, adhesive layer, wafer work piece and method for manufacturing semiconductor device using same, rework solvent, polyimide copolymer, polyimide mixed resin, and resin compostionTORAY INDUSTRIES·Filed 2018·Granted Mar 9, 2021·0 cites·10 claims
- 0448US10177022B2Adhesive for temporary bonding, adhesive layer, wafer work piece and method for manufacturing semiconductor device using same, rework solvent, polyimide copolymer, polyimide mixed resin, and resin compositionTORAY INDUSTRIES·Filed 2015·Granted Jan 8, 2019·0 cites·11 claims
- 0548US2024376348A1Adhesive, substrate having adhesive, circuit board having adhesive layer, layered product, method for producing layered product, and method for producing semiconductor deviceTORAY INDUSTRIES·Filed 2022·Application pending·0 cites
- 0645US9048445B2Gate insulating material, gate insulating film and organic field-effect transistorMURASE SEIICHIRO·Filed 2009·Granted Jun 2, 2015·0 cites·12 claims
- 0744US10451969B2Resin composition, method for manufacturing semiconductor element using the same, and semiconductor deviceTORAY INDUSTRIES·Filed 2016·Granted Oct 22, 2019·0 cites·14 claims
- 0844US2024186172A1Laminate, resin composition, and method for manufacturing semiconductor deviceTORAY INDUSTRIES·Filed 2022·Application pending·0 cites
- 0942US2018281361A1Laminate film for temporary bonding, methods for producing substrate workpiece and laminate substrate workpiece using the laminate film for temporary bonding, and method for producing semiconductor device using the sameTORAY INDUSTRIES·Filed 2016·Application pending·0 cites
- 1041US2012237873A1Positive photosensitive resin composition, cured film formed from the same, and device having cured filmFUJIWARA TAKENORI·Filed 2010·Application pending·0 cites
- 1137US11186757B2Resin composition, resin layer, permanent adhesive, adhesive for temporary bonding, laminated film, processed wafer, and method for manufacturing electronic component or semiconductor deviceTORAY INDUSTRIES·Filed 2017·Granted Nov 30, 2021·0 cites·25 claims
- 1237US9377686B2Photosensitive resin composition, conductive wire protection film, and touch panel memberTORAY INDUSTRIES·Filed 2013·Granted Jun 28, 2016·0 cites·8 claims
- 1331US10409163B2Photosensitive resin composition, cured film, element provided with cured film, and method for manufacturing semiconductor deviceTORAY INDUSTRIES·Filed 2015·Granted Sep 10, 2019·0 cites·22 claims
- 1430US2017243737A1Method for manufacturing semiconductor device and semiconductor deviceTORAY INDUSTRIES·Filed 2015·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Takenori Fujiwara files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →