Inventor · disambiguated record
Takuya Fukuda
Also filed as: FUKUDA TAKUYA
59 granted patents·23 pending applications·1,380 citations·filing 1988–2025
99Inventor score
Files withHITACHI LTD27KAWASAKI HEAVY IND LTD16NISSAN CHEMICAL CORP12ADEKA CORP10YASKAWA DENKI SEISAKUSHO KK5
Top patents by PatentIndex Score
82 records- 0198US6432769B1Semiconductor integrated circuit device and process for manufacture the sameHITACHI LTD·Filed 2000·Granted Aug 13, 2002·131 cites·3 claims
- 0295US7588117B2Structure and method for mounting drive motorNISSAN MOTOR·Filed 2004·Granted Sep 15, 2009·70 cites·12 claims
- 0393US4876983APlasma operation apparatusHITACHI LTD·Filed 1988·Granted Oct 31, 1989·70 cites·18 claims
- 0492US6278148B1Semiconductor device having a shielding conductorHITACHI LTD·Filed 1998·Granted Aug 21, 2001·139 cites·4 claims
- 0591US10882974B2Particulate nucleating agent, resin composition, molded product, and production method thereofADEKA CORP·Filed 2018·Granted Jan 5, 2021·3 cites·10 claims
- 0691US6258649B1Semiconductor integrated circuit device and method of manufacturing the sameHITACHI LTD·Filed 1999·Granted Jul 10, 2001·91 cites·11 claims
- 0790US12370621B2Friction stir tool control method and friction stir deviceKAWASAKI HEAVY IND LTD·Filed 2022·Granted Jul 29, 2025·2 cites·3 claims
- 0890US5449411AMicrowave plasma processing apparatusHITACHI LTD·Filed 1993·Granted Sep 12, 1995·82 cites·16 claims
- 0989US10800800B2Composition, thermoplastic resin composition containing the same, and molded article thereofADEKA CORP·Filed 2019·Granted Oct 13, 2020·2 cites·10 claims
- 1088US6255151B1Semiconductor integrated circuit device and method of manufacturing sameHITACHI LTD·Filed 1998·Granted Jul 3, 2001·81 cites·32 claims
- 1188US6215144B1Semiconductor integrated circuit device, and method of manufacturing the sameHITACHI LTD·Filed 1999·Granted Apr 10, 2001·73 cites·19 claims
- 1287US11839929B2Dissimilar metal welding methodTOYOTA MOTOR CO LTD·Filed 2020·Granted Dec 12, 2023·2 cites·2 claims
- 1387US11306194B2Nucleating agent, polyolefin-based resin composition containing same, and molded article thereofADEKA CORP·Filed 2019·Granted Apr 19, 2022·1 cites·4 claims
- 1487US10982072B2Particulate nucleating agent, resin composition, molded product, and production method thereofADEKA CORP·Filed 2019·Granted Apr 20, 2021·2 cites·12 claims
- 1587US6423992B2Semiconductor integrated circuit deviceHITACHI LTD·Filed 2001·Granted Jul 23, 2002·35 cites·22 claims
- 1687US6399438B2Method of manufacturing semiconductor integrated circuit device having a capacitorHITACHI LTD·Filed 2001·Granted Jun 4, 2002·32 cites·17 claims
- 1787US5496410APlasma processing apparatus and method of processing substrates by using same apparatusHITACHI LTD·Filed 1993·Granted Mar 5, 1996·65 cites·26 claims
- 1886US12496655B2Friction stir joining device, method of operating the same and joint structureKAWASAKI HEAVY IND LTD·Filed 2024·Granted Dec 16, 2025·0 cites·6 claims
- 1986US11578188B2Composition, thermoplastic resin composition using same, and molded article of sameADEKA CORP·Filed 2018·Granted Feb 14, 2023·1 cites·4 claims
- 2085US8650965B2Robot, robot system, robot control device, and state determining methodHASHIGUCHI YUKIO·Filed 2011·Granted Feb 18, 2014·19 cites·14 claims
- 2184US12447551B2Method for controlling friction stir welding device, and friction stir welding deviceKAWASAKI HEAVY IND LTD·Filed 2022·Granted Oct 21, 2025·1 cites·6 claims
- 2284US12064831B2Joining system, and method for operating sameKAWASAKI HEAVY IND LTD·Filed 2020·Granted Aug 20, 2024·1 cites·16 claims
- 2384US5211825APlasma processing apparatus and the method of the sameHITACHI LTD·Filed 1991·Granted May 18, 1993·70 cites·17 claims
- 2483US12122899B2Composition, thermoplastic resin composition using same, and molded article of sameADEKA CORP·Filed 2023·Granted Oct 22, 2024·0 cites·2 claims
- 2583US11292076B2Friction spot joining device and friction spot joining methodKAWASAKI HEAVY IND LTD·Filed 2016·Granted Apr 5, 2022·2 cites·4 claims
- 2683US11185944B2Friction stir spot welding device and friction stir spot welding methodKAWASAKI HEAVY IND LTD·Filed 2017·Granted Nov 30, 2021·2 cites·8 claims
- 2782US6360142B1Random work arranging deviceKAWASAKI HEAVY IND LTD·Filed 2000·Granted Mar 19, 2002·39 cites·25 claims
- 2882US5162633AMicrowave-excited plasma processing apparatusHITACHI LTD·Filed 1989·Granted Nov 10, 1992·27 cites·36 claims
- 2979US2025326048A1Friction stir tool control method and friction stir deviceKAWASAKI HEAVY IND LTD·Filed 2025·Application pending·0 cites
- 3079US2025376645A1Method for producing processed semiconductor substrateNISSAN CHEMICAL CORP·Filed 2025·Application pending·0 cites
- 3177US2022204724A1Nucleating agent, polyolefin-based resin composition containing same, and molded article thereofADEKA CORP·Filed 2022·Application pending·0 cites
- 3276US6479899B1Semiconductor integrated circuit device and process for manufacturing the sameHITACHI LTD·Filed 1996·Granted Nov 12, 2002·26 cites·13 claims
- 3376US5552625ASemiconductor device having a semi-insulating layerHITACHI LTD·Filed 1994·Granted Sep 3, 1996·41 cites·17 claims
- 3475US5745336ACapacitor for semiconductor integrated circuitHITACHI LTD·Filed 1995·Granted Apr 28, 1998·36 cites·16 claims
- 3574US5986299ASemiconductor integrated circuit device having multi-level wiring capacitor structuresHITACHI LTD·Filed 1997·Granted Nov 16, 1999·40 cites·13 claims
- 3673US6833331B2Method of manufacturing semiconductor integrated circuit device having insulating film formed from liquid substance containing polymer of silicon, oxygen, and hydrogenHITACHI LTD·Filed 2002·Granted Dec 21, 2004·13 cites·10 claims
- 3773US2024301263A1Adhesive composition for infrared peeling, laminate, method for producing laminate, and peeling methodNISSAN CHEMICAL CORP·Filed 2024·Application pending·0 cites
- 3871US9773691B2Substrate conveying systemKAWASAKI HEAVY IND LTD·Filed 2013·Granted Sep 26, 2017·3 cites·9 claims
- 3969US12168261B2Friction stir joining device, method of operating the same and joint structureKAWASAKI HEAVY IND LTD·Filed 2019·Granted Dec 17, 2024·0 cites·4 claims
- 4069US6509277B1Method of manufacturing semiconductor integrated circuit device having insulatro film formed from liquid containing polymer of silicon, oxygen, and hydrogenHITACHI LTD·Filed 2000·Granted Jan 21, 2003·10 cites·26 claims
- 4168US6638811B2Method of manufacturing a semiconductor integrated circuit device having a capacitorHITACHI LTD·Filed 2002·Granted Oct 28, 2003·9 cites·8 claims
- 4267US10889003B2Robot system, robot controller, and method for controlling robotYASKAWA ELECTRIC CORP·Filed 2018·Granted Jan 12, 2021·1 cites·20 claims
- 4367US6303478B1Semiconductor integrated circuit device and method for fabricating the sameHIATCHI LTD·Filed 1999·Granted Oct 16, 2001·30 cites·20 claims
- 4466US12454024B2Joining method and joined bodyKAWASAKI HEAVY IND LTD·Filed 2022·Granted Oct 28, 2025·0 cites·5 claims
- 4566US12024622B2Composition, thermoplastic resin composition using same, and molded article thereofADEKA CORP·Filed 2018·Granted Jul 2, 2024·0 cites·13 claims
- 4666US9833905B2Robot system and method for manufacturing componentYASKAWA ELECTRIC CORP·Filed 2014·Granted Dec 5, 2017·1 cites·22 claims
- 4766US9346162B2Robot system, control device of robot, and robot control deviceYASKAWA DENKI SEISAKUSHO KK·Filed 2014·Granted May 24, 2016·3 cites·15 claims
- 4866US5434742ACapacitor for semiconductor integrated circuit and method of manufacturing the sameHITACHI LTD·Filed 1992·Granted Jul 18, 1995·23 cites·25 claims
- 4966US5084355ALaminar structure comprising organic material and inorganic materialHITACHI LTD·Filed 1989·Granted Jan 28, 1992·30 cites·5 claims
- 5064US11135674B2Friction stir spot welding method and friction stir spot welding deviceKAWASAKI HEAVY IND LTD·Filed 2017·Granted Oct 5, 2021·0 cites·8 claims
Showing the top 50 of 82 patent records by PatentIndex Score.
Join the waitlist — get patent alerts
Get an alert when Takuya Fukuda files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →