Inventor · disambiguated record
Takakazu Fukumoto
Also filed as: FUKUMOTO TAKAKAZU
10 granted patents·2 pending applications·304 citations·filing 1997–2003
90Inventor score
Technology areasH10W
Top patents by PatentIndex Score
12 records- 0194US6038132AMemory moduleMITSUBISHI ELECTRIC CORP·Filed 1997·Granted Mar 14, 2000·216 cites·14 claims
- 0285US6777798B2Stacked semiconductor device structureRENESAS TECH CORP·Filed 2003·Granted Aug 17, 2004·37 cites·7 claims
- 0360US6688892B2Clip-type lead frame for electrically connecting two substrates or devicesRENESAS TECH CORP·Filed 2002·Granted Feb 10, 2004·12 cites·8 claims
- 0455USD465773SSemiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2001·Granted Nov 19, 2002·9 cites·1 claims
- 0555USD459317SSemiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2001·Granted Jun 25, 2002·9 cites·1 claims
- 0652USD461171SSemiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2001·Granted Aug 6, 2002·8 cites·1 claims
- 0744USD459316SSemiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2001·Granted Jun 25, 2002·5 cites·1 claims
- 0841USD460951SSemiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2001·Granted Jul 30, 2002·4 cites·1 claims
- 0937US2002105068A1Stacked semiconductor device structureMITSUBISHI ELECTRIC CORP·Filed 2001·Application pending·0 cites
- 1036US2004130017A1Stacked layer type semiconductor device and its manufacturing methodRENESAS TECH CORP·Filed 2003·Application pending·0 cites
- 1135USD460744SSemiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2001·Granted Jul 23, 2002·2 cites·1 claims
- 1235USD458234SSemiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2001·Granted Jun 4, 2002·2 cites·1 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →