Inventor · disambiguated record
Tadao Fukuta
Also filed as: FUKUTA TADAO
4 granted patents·8 pending applications·2 citations·filing 2021–2023
58Inventor score
Files withSEIKO EPSON CORP12
Top patents by PatentIndex Score
12 records- 0192US11865609B2Method for manufacturing powder-modified magnesium alloy chipSEIKO EPSON CORP·Filed 2021·Granted Jan 9, 2024·2 cites·6 claims
- 0278US11878345B2Thixomolding materialSEIKO EPSON CORP·Filed 2022·Granted Jan 23, 2024·0 cites·3 claims
- 0367US2024217813A1Thixotropically Molded Product, Thixotropic Molding Material, And Method Of Producing Thixotropic Molding MaterialSEIKO EPSON CORP·Filed 2023·Application pending·0 cites
- 0464US2024218484A1Thixotropic Molding Material, Method Of Producing Thixotropic Molding Material, And Thixotropically Molded ProductSEIKO EPSON CORP·Filed 2023·Application pending·0 cites
- 0564US2024218521A1Molded Product, Thixotropic Molding Material, And Method Of Producing Thixotropic Molding MaterialSEIKO EPSON CORP·Filed 2023·Application pending·0 cites
- 0662US11548066B2Injection molding material for magnesium thixomoldingSEIKO EPSON CORP·Filed 2021·Granted Jan 10, 2023·0 cites·3 claims
- 0762US2024216988A1Thixotropically Molded Product, Thixotropic Molding Material, And Method Of Producing Thixotropic Molding MaterialSEIKO EPSON CORP·Filed 2023·Application pending·0 cites
- 0862US2024218522A1Thixotropically Molded Product, Thixotropic Molding Material, And Method Of Producing Thixotropic Molding MaterialSEIKO EPSON CORP·Filed 2023·Application pending·0 cites
- 0956US2024218230A1Thixotropically Molded Product And Thixotropic Molding MaterialSEIKO EPSON CORP·Filed 2023·Application pending·0 cites
- 1056US2022316035A1Thixomolding material, method for manufacturing thixomolding material, and thixomolded articleSEIKO EPSON CORP·Filed 2022·Application pending·0 cites
- 1155US12311437B2Thixomolding materialSEIKO EPSON CORP·Filed 2022·Granted May 27, 2025·0 cites·3 claims
- 1249US2022316070A1Thixomolding material, method for manufacturing thixomolding material, and thixomolded articleSEIKO EPSON CORP·Filed 2022·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Tadao Fukuta files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →