Inventor · disambiguated record
Takao Funamoto
Also filed as: FUNAMOTO TAKAO
17 granted patents·541 citations·filing 1984–2006
95Inventor score
Top patents by PatentIndex Score
17 records- 0191US5938954ASubmerged laser beam irradiation equipmentHITACHI LTD·Filed 1996·Granted Aug 17, 1999·100 cites·20 claims
- 0291US4645119AMethod of brazing an aluminum heat exchangerHITACHI LTD·Filed 1984·Granted Feb 24, 1987·53 cites·8 claims
- 0390US5234154AMethod and apparatus for joining hot stripsHITACHI LTD·Filed 1992·Granted Aug 10, 1993·30 cites·34 claims
- 0483US6225598B1Method of high frequency pulse arc welding and apparatus thereforHITACHI LTD·Filed 1998·Granted May 1, 2001·52 cites·16 claims
- 0583US5051397AJoined body of high-temperature oxide superconductor and method of joining oxide superconductorsHITACHI LTD·Filed 1989·Granted Sep 24, 1991·35 cites·7 claims
- 0680US5884832AMethod of bonding metal plates, apparatus therefor and hot strip millHITACHI LTD·Filed 1996·Granted Mar 23, 1999·17 cites·19 claims
- 0779US5035579AWater-turbine runner and process for manufacturing the sameHITACHI LTD·Filed 1989·Granted Jul 30, 1991·40 cites·14 claims
- 0876US4740866ASealed-type liquid cooling device with expandable bellow for semiconductor chipsHITACHI LTD·Filed 1986·Granted Apr 26, 1988·52 cites·9 claims
- 0973US6077615AGas turbine nozzle, power generation gas turbine, co-base alloy and welding materialHITACHI LTD·Filed 1997·Granted Jun 20, 2000·34 cites·18 claims
- 1070US8584923B2Joining method of high carbon steel for endless hot rolling and the apparatus thereforLEE JONG-SUB·Filed 2006·Granted Nov 19, 2013·5 cites·4 claims
- 1164US4996589ASemiconductor module and cooling device of the sameHITACHI LTD·Filed 1988·Granted Feb 26, 1991·30 cites·11 claims
- 1258US5231366ASuperconducting magnetic field generating apparatus and method of producing the sameHITACHI LTD·Filed 1991·Granted Jul 27, 1993·23 cites·17 claims
- 1357US4691856ADiffusion bonding method using a high energy beamHITACHI LTD·Filed 1985·Granted Sep 8, 1987·16 cites·7 claims
- 1453US6955287B2Method of bonding metal plates, apparatus therefor and hot strip millRES INSTITUTION OF IND SCIENCE·Filed 2000·Granted Oct 18, 2005·6 cites·4 claims
- 1553US4809058AIntegrated circuit deviceHITACHI LTD·Filed 1986·Granted Feb 28, 1989·20 cites·15 claims
- 1651US6213381B1Method of bonding metal plates, apparatus therefor and hot strip millHITACHI LTD·Filed 1998·Granted Apr 10, 2001·15 cites·16 claims
- 1750US4902867AMethod of joining an insulated wire to a conductive terminalHITACHI LTD·Filed 1988·Granted Feb 20, 1990·13 cites·12 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →