Inventor · disambiguated record
Takashi Gondaira
Also filed as: GONDAIRA Takashi
5 granted patents·2 pending applications·4 citations·filing 2017–2021
65Inventor score
Files withARISAWA SEISAKUSHO KK7
Top patents by PatentIndex Score
7 records- 0178US11402754B2Photosensitive resin composition, solder resist film using said photosensitive resin composition, flexible printed wiring board, and image display deviceARISAWA SEISAKUSHO KK·Filed 2017·Granted Aug 2, 2022·2 cites·12 claims
- 0270US10627716B2Photosensitive resin composition, solder resist film using said photosensitive resin composition, flexible printed circuit and image display deviceARISAWA SEISAKUSHO KK·Filed 2017·Granted Apr 21, 2020·2 cites·9 claims
- 0362US2025122371A1Thermosetting resin composition, coverlay film, adhesive sheet, and flexible printed circuit boardARISAWA SEISAKUSHO KK·Filed 2021·Application pending·0 cites
- 0454US11884815B2Thermosetting resin composition, coverlay film, adhesive sheet, and flexible printed wiring boardARISAWA SEISAKUSHO KK·Filed 2021·Granted Jan 30, 2024·0 cites·8 claims
- 0546US12122867B2Photocurable resin composition and use thereofARISAWA SEISAKUSHO KK·Filed 2019·Granted Oct 22, 2024·0 cites·17 claims
- 0640US2021311389A1Resin composition for resists and use thereofARISAWA SEISAKUSHO KK·Filed 2019·Application pending·0 cites
- 0738US11609493B2Photosensitive resin composition, solder resist film using said photosensitive resin composition, flexible printed circuit and image display deviceARISAWA SEISAKUSHO KK·Filed 2018·Granted Mar 21, 2023·0 cites·11 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →