Inventor · disambiguated record
Takao Haino
Also filed as: HAINO TAKAO
2 granted patents·2 pending applications·5 citations·filing 2006–2007
42Inventor score
Top patents by PatentIndex Score
4 records- 0161US7765678B2Method of bonding metal ball for magnetic head assemblyTDK CORP·Filed 2006·Granted Aug 3, 2010·5 cites·9 claims
- 0242US7649715B2Magnetic head assembly bonding electrode pad of slider and electrode pad of flexible wiring substrate together by solderTDK CORP·Filed 2006·Granted Jan 19, 2010·0 cites·4 claims
- 0341US2007274006A1Method of reworking magnetic head assembly in which electrode pad of magnetic head slider and electrode pad of suspension are soldered to each otherALPS ELECTRIC CO LTD·Filed 2007·Application pending·0 cites
- 0438US2007097549A1MAGNETIC HEAD ASSEMBLY HAVING AuSn DISPERSION LAYER AND METHOD OF SOLDER BONDINGALPS ELECTRIC CO LTD·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →