Inventor · disambiguated record
Tadaaki Harada
Also filed as: HARADA TADAAKI
7 granted patents·4 pending applications·93 citations·filing 1990–2004
85Inventor score
Files withNITTO DENKO CORP10
Top patents by PatentIndex Score
11 records- 0180US6555602B1Composition of epoxy resin, anhydride and microcapsule acceleratorNITTO DENKO CORP·Filed 2000·Granted Apr 29, 2003·32 cites·5 claims
- 0274US7259803B2Resin sheet, liquid crystal cell substrate comprising the sameNITTO DENKO CORP·Filed 2003·Granted Aug 21, 2007·21 cites·18 claims
- 0360US7034404B1Resin composition for semiconductor encapsulation, semiconductor device obtained with the same, and process for producing semiconductor deviceNITTO DENKO CORP·Filed 2000·Granted Apr 25, 2006·11 cites·21 claims
- 0450US2007042168A1Resin sheet, liquid crystal cell substrate, liquid crystal display device, substrate for an electroluminescence display device, electroluminescence display device, and a substrate for a solar cellNITTO DENKO CORP·Filed 2004·Application pending·0 cites
- 0549US7714976B2Optical resin sheet and liquid crystal cell substrate including the same, liquid crystal display device, substrate for an image display device, and image display deviceNITTO DENKO CORP·Filed 2004·Granted May 11, 2010·3 cites·8 claims
- 0641US5107327APhotosemiconductor device and epoxy resin composition for use in molding photosemiconductorNITTO DENKO CORP·Filed 1990·Granted Apr 21, 1992·17 cites·12 claims
- 0738US2007117485A1Laminated filmNITTO DENKO CORP·Filed 2004·Application pending·0 cites
- 0837US2007128376A1Resin sheet, liquid crystal cell substrate, liquid crytal display device, substrate for an electroluminescence display device, electroluminescence display device, and substrate for a solar cellNITTO DENKO CORP·Filed 2004·Application pending·0 cites
- 0933US6410615B1Semiconductor sealing epoxy resin composition and semiconductor device using the sameNITTO DENKO CORP·Filed 1999·Granted Jun 25, 2002·5 cites·5 claims
- 1032US2002043728A1Resin composition for sealing semiconductor, semiconductor device using the same, semiconductor wafer and mounted structure of semiconductor deviceFiled 2001·Application pending·0 cites
- 1125US6001483AModified alkyl-terminated encapsulant for semiconductor of epoxy resin and polyethylene oxideNITTO DENKO CORP·Filed 1995·Granted Dec 14, 1999·4 cites·8 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →