Inventor · disambiguated record

Takao Haranosono

Also filed as: HARANOSONO TAKAO

3 granted patents·387 citations·filing 1994–1996

80Inventor score

Technology areasH10W

Files withFUJITSU LTD3

Top patents by PatentIndex Score

3 records

0193US5724233ASemiconductor device having first and second semiconductor chips with a gap therebetween, a die stage in the gap and associated lead frames disposed in a package, the lead frames providing electrical connections from the chips to an exterior of the packagFUJITSU LTD·Filed 1996·Granted Mar 3, 1998·180 cites·7 claims
0292US5471369ASemiconductor device having a plurality of semiconductor chipsFUJITSU LTD·Filed 1994·Granted Nov 28, 1995·148 cites·8 claims
0380US5579208ASemiconductor device having a plurality of semiconductor chipsFUJITSU LTD·Filed 1995·Granted Nov 26, 1996·59 cites·7 claims

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →