Inventor · disambiguated record
Takehiko Hasebe
Also filed as: HASEBE TAKEHIKO
10 granted patents·5 pending applications·340 citations·filing 2000–2011
92Inventor score
Files withHITACHI LTD7RENESAS TECH CORP3HASEBE TAKEHIKO2HITACHI VIA MECHANICS LTD1YAMAGUCHI YOSHIHIDE1
Top patents by PatentIndex Score
15 records- 0196US6744135B2Electronic apparatusHITACHI LTD·Filed 2002·Granted Jun 1, 2004·104 cites·13 claims
- 0295US7355270B2Semiconductor chip with coil antenna and communication systemHITACHI LTD·Filed 2005·Granted Apr 8, 2008·51 cites·6 claims
- 0391US7049837B2Probe sheet, probe card, semiconductor test equipment and semiconductor device fabrication methodRENESAS TECH CORP·Filed 2003·Granted May 23, 2006·65 cites·26 claims
- 0490US7425762B2Electronic apparatusHITACHI LTD·Filed 2006·Granted Sep 16, 2008·15 cites·5 claims
- 0588US6506982B1Multi-layer wiring substrate and manufacturing method thereofHITACHI LTD·Filed 2000·Granted Jan 14, 2003·39 cites·11 claims
- 0683US7145231B2Electronic apparatusHITACHI LTD·Filed 2004·Granted Dec 5, 2006·26 cites·15 claims
- 0780US7351597B2Fabrication method of semiconductor integrated circuit deviceRENESAS TECH CORP·Filed 2007·Granted Apr 1, 2008·10 cites·9 claims
- 0879US7219422B2Fabrication method of semiconductor integrated circuit deviceRENESAS TECH CORP·Filed 2004·Granted May 22, 2007·21 cites·8 claims
- 0971US7567019B2Actuator systemHITACHI LTD·Filed 2007·Granted Jul 28, 2009·6 cites·8 claims
- 1065US8992665B2Metal recovery method and dialysis deviceYAMAGUCHI YOSHIHIDE·Filed 2010·Granted Mar 31, 2015·3 cites·23 claims
- 1154US2009008128A1Electronic apparatusHASEBE TAKEHIKO·Filed 2008·Application pending·0 cites
- 1246US2009111062A1Pattern Formation MethodHITACHI VIA MECHANICS LTD·Filed 2008·Application pending·0 cites
- 1344US2007030791A1Probe memory device and positioning method thereforHITACHI LTD·Filed 2006·Application pending·0 cites
- 1440US2003019663A1Multi-layer wiring substrate and manufacturing method thereofFiled 2002·Application pending·0 cites
- 1535US2011237001A1Semiconductor chip used for evaluation, evaluation system, and repairing method thereofHASEBE TAKEHIKO·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →