Inventor · disambiguated record
Takuto Hidani
Also filed as: HIDANI TAKUTO
1 granted patent·2 pending applications·0 citations·filing 2021–2023
9Inventor score
Files withSUMITOMO ELECTRIC INDUSTRIES3
Top patents by PatentIndex Score
3 records- 0152US12058812B2Substrate for a printed wiring boardSUMITOMO ELECTRIC INDUSTRIES·Filed 2021·Granted Aug 6, 2024·0 cites·9 claims
- 0250US2024407085A1Printed circuit boardSUMITOMO ELECTRIC INDUSTRIES·Filed 2023·Application pending·0 cites
- 0348US2023371176A1Base material for printed circuit, printed circuit, and method of manufacturing base material for printed circuitSUMITOMO ELECTRIC INDUSTRIES·Filed 2021·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →