Inventor · disambiguated record
Takehiro Hirai
Also filed as: HIRAI TAKEHIRO
86 granted patents·17 pending applications·769 citations·filing 1991–2024
99Inventor score
Files withHITACHI HIGH TECH CORP48MATSUSHITA ELECTRIC INDUSTRIAL CO LTD20HIRAI TAKEHIRO5NAKAGAKI RYO4HARADA MINORU3
Top patents by PatentIndex Score
103 records- 0196US10906974B2Anti-GPR20 antibody and anti-GPR20 antibody-drug conjugateDAIICHI SANKYO CO LTD·Filed 2020·Granted Feb 2, 2021·9 cites·30 claims
- 0296US7485858B1Inspection method for semiconductor wafer and apparatus for reviewing defectsHITACHI HIGH TECH CORP·Filed 2006·Granted Feb 3, 2009·23 cites·3 claims
- 0395US6140687AHigh frequency ring gate MOSFETMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1997·Granted Oct 31, 2000·215 cites·6 claims
- 0492US7449898B2Method and apparatus for reviewing defects by detecting images having voltage contrastHITACHI HIGH TECH CORP·Filed 2007·Granted Nov 11, 2008·14 cites·14 claims
- 0591US9305343B2Observation device and observation methodHITACHI HIGH TECH CORP·Filed 2014·Granted Apr 5, 2016·7 cites·14 claims
- 0690US9401015B2Defect classification method, and defect classification systemMINEKAWA YOHEI·Filed 2012·Granted Jul 26, 2016·12 cites·14 claims
- 0788US8595666B2Semiconductor defect classifying method, semiconductor defect classifying apparatus, and semiconductor defect classifying programHAYAKAWA KOICHI·Filed 2010·Granted Nov 26, 2013·10 cites·24 claims
- 0888US5736421ASemiconductor device and associated fabrication methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1996·Granted Apr 7, 1998·78 cites·6 claims
- 0987US8309919B2Inspection method for semiconductor wafer and apparatus for reviewing defectsOBARA KENJI·Filed 2009·Granted Nov 13, 2012·10 cites·3 claims
- 1084US9390490B2Method and device for testing defect using SEMTAKAGI YUJI·Filed 2010·Granted Jul 12, 2016·7 cites·5 claims
- 1183US9733194B2Method for reviewing a defect and apparatusHITACHI HIGH TECH CORP·Filed 2015·Granted Aug 15, 2017·2 cites·15 claims
- 1283US7656171B2Method and apparatus for reviewing defects by detecting images having voltage contrastHITACHI HIGH TECH CORP·Filed 2008·Granted Feb 2, 2010·5 cites·10 claims
- 1382US10810733B2Defect classification apparatus and defect classification methodHITACHI HIGH TECH CORP·Filed 2016·Granted Oct 20, 2020·5 cites·6 claims
- 1482US9311697B2Inspection method and device thereforHARADA MINORU·Filed 2011·Granted Apr 12, 2016·6 cites·17 claims
- 1581US9569836B2Defect observation method and defect observation deviceHITACHI HIGH TECH CORP·Filed 2013·Granted Feb 14, 2017·5 cites·13 claims
- 1681US8824773B2Defect observation method and defect observation deviceMINEKAWA YOHEI·Filed 2010·Granted Sep 2, 2014·6 cites·20 claims
- 1780US6297517B1Semiconductor device and method of fabricating the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2000·Granted Oct 2, 2001·24 cites·4 claims
- 1879US9922414B2Defect inspection method and defect inspection deviceHITACHI HIGH TECH CORP·Filed 2014·Granted Mar 20, 2018·4 cites·30 claims
- 1979US9165356B2Defect inspection method and defect inspection deviceHARADA MINORU·Filed 2012·Granted Oct 20, 2015·4 cites·20 claims
- 2078US9020237B2Method for optimizing observed image classification criterion and image classification apparatusHIRAI TAKEHIRO·Filed 2011·Granted Apr 28, 2015·6 cites·6 claims
- 2177US10559074B2Sample observation device and sample observation methodHITACHI HIGH TECH CORP·Filed 2018·Granted Feb 11, 2020·2 cites·16 claims
- 2277US6770517B2Semiconductor device and method for fabricating the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Aug 3, 2004·20 cites·3 claims
- 2377US6337500B1Semiconductor device and method for fabricating the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1998·Granted Jan 8, 2002·35 cites·5 claims
- 2476US9280814B2Charged particle beam apparatus that performs image classification assistanceHIRAI TAKEHIRO·Filed 2012·Granted Mar 8, 2016·4 cites·9 claims
- 2576US9177757B2Charged particle beam apparatusHITACHI HIGH TECH CORP·Filed 2013·Granted Nov 3, 2015·3 cites·6 claims
- 2676US8526710B2Defect review method and apparatusNAKAGAKI RYO·Filed 2008·Granted Sep 3, 2013·7 cites·16 claims
- 2775US9335277B2Region-of-interest determination apparatus, observation tool or inspection tool, region-of-interest determination method, and observation method or inspection method using region-of-interest determination methodNAKAGAKI RYO·Filed 2012·Granted May 10, 2016·3 cites·15 claims
- 2875US7584012B2Automatic defect review and classification systemHITACHI HIGH TECH CORP·Filed 2007·Granted Sep 1, 2009·5 cites·2 claims
- 2974US8653456B2Pattern inspection method, pattern inspection program, and electronic device inspection systemTOYODA YASUTAKA·Filed 2011·Granted Feb 18, 2014·3 cites·18 claims
- 3074US8341518B2Report format setting method and apparatus, and defect review systemHIRAI TAKEHIRO·Filed 2010·Granted Dec 25, 2012·3 cites·7 claims
- 3173US11170483B2Sample observation device and sample observation methodHITACHI HIGH TECH CORP·Filed 2019·Granted Nov 9, 2021·1 cites·13 claims
- 3273US10971325B2Defect observation system and defect observation method for semiconductor waferHITACHI HIGH TECH CORP·Filed 2019·Granted Apr 6, 2021·1 cites·16 claims
- 3373US6968079B2Investigation device and investigation methodHITACHI LTD·Filed 2001·Granted Nov 22, 2005·20 cites·10 claims
- 3472US7836398B2Report format setting method and apparatus, and defect review systemHITACHI HIGH TECH CORP·Filed 2007·Granted Nov 16, 2010·4 cites·13 claims
- 3571US9811897B2Defect observation method and defect observation deviceHITACHI HIGH TECH CORP·Filed 2013·Granted Nov 7, 2017·3 cites·12 claims
- 3671US9342879B2Method and apparatus for reviewing defectMINEKAWA YOHEI·Filed 2012·Granted May 17, 2016·3 cites·17 claims
- 3768US11087454B2Defect observation device and defect observation methodHITACHI HIGH TECH CORP·Filed 2017·Granted Aug 10, 2021·1 cites·9 claims
- 3868US8330248B2Semiconductor device, mask for fabrication of semiconductor device, and optical proximity correction methodTABATA YASUKO·Filed 2011·Granted Dec 11, 2012·3 cites·20 claims
- 3968US7752001B2Method of correcting coordinates, and defect review apparatusHITACHI HIGH TECH CORP·Filed 2007·Granted Jul 6, 2010·5 cites·8 claims
- 4068US2025124566A1Defect Inspection System and Defect Inspection MethodHITACHI HIGH TECH CORP·Filed 2024·Application pending·0 cites
- 4167US9342878B2Charged particle beam apparatusYAMAGUCHI KOHEI·Filed 2011·Granted May 17, 2016·2 cites·14 claims
- 4267US8892494B2Device for classifying defects and method for adjusting classificationONO MAKOTO·Filed 2010·Granted Nov 18, 2014·3 cites·9 claims
- 4366US9685301B2Charged-particle radiation apparatusHITACHI HIGH TECH CORP·Filed 2013·Granted Jun 20, 2017·1 cites·17 claims
- 4466US8013299B2Review method and review deviceHITACHI HIGH TECH CORP·Filed 2009·Granted Sep 6, 2011·1 cites·6 claims
- 4566US6395598B1Semiconductor device and method for fabricating the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1999·Granted May 28, 2002·26 cites·9 claims
- 4665US9040937B2Charged particle beam apparatusHITACHI HIGH TECH CORP·Filed 2013·Granted May 26, 2015·1 cites·14 claims
- 4765US8108172B2Defect review apparatus and method of reviewing defectsHIRAI TAKEHIRO·Filed 2010·Granted Jan 31, 2012·1 cites·9 claims
- 4865US7664562B2Automatic defect review and classification systemHITACHI HIGH TECH CORP·Filed 2006·Granted Feb 16, 2010·2 cites·11 claims
- 4964US10297021B2Defect quantification method, defect quantification device, and defect evaluation value display deviceHITACHI HIGH TECH CORP·Filed 2015·Granted May 21, 2019·1 cites·17 claims
- 5064US9582875B2Defect analysis assistance device, program executed by defect analysis assistance device, and defect analysis systemHITACHI HIGH TECH CORP·Filed 2013·Granted Feb 28, 2017·1 cites·12 claims
Showing the top 50 of 103 patent records by PatentIndex Score.
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