Inventor · disambiguated record
Taisuke Hirooka
Also filed as: HIROOKA TAISUKE
15 granted patents·4 pending applications·73 citations·filing 1999–2025
91Inventor score
Top patents by PatentIndex Score
19 records- 0181US10283351B2Single-crystal silicon carbide substrate, method for producing single-crystal silicon carbide substrate, and method for inspecting single-crystal silicon carbide substrateHITACHI METALS LTD·Filed 2016·Granted May 7, 2019·3 cites·8 claims
- 0277US7641736B2Method of manufacturing SiC single crystal waferHITACHI METALS LTD·Filed 2005·Granted Jan 5, 2010·6 cites·13 claims
- 0376US6924090B2Method of recording identifier and set of photomasksNEOMAX CO LTD·Filed 2002·Granted Aug 2, 2005·16 cites·29 claims
- 0471US8530353B2SiC substrate and method of manufacturing the sameHIROOKA TAISUKE·Filed 2011·Granted Sep 10, 2013·3 cites·18 claims
- 0569US8159783B2Substrate with intermediate layer for thin-film magnetic head and method of manufacturing the substrate with intermediate layerHIROOKA TAISUKE·Filed 2005·Granted Apr 17, 2012·3 cites·19 claims
- 0668US6906895B2Method of marking sintered body and method for manufacturing magnetic head waferNEOMAX CO LTD·Filed 2003·Granted Jun 14, 2005·6 cites·14 claims
- 0763US7114239B2Method for manufacturing a thin-film magnetic head waferNEOMAX CO LTD·Filed 2003·Granted Oct 3, 2006·4 cites·12 claims
- 0859US12205989B2Silicon carbide epitaxial substrate and method for manufacturing samePROTERIAL LTD·Filed 2022·Granted Jan 21, 2025·0 cites·11 claims
- 0958US6897010B2Method of recording identifier and set of photomasksNEOMAX CO LTD·Filed 2002·Granted May 24, 2005·9 cites·26 claims
- 1057US7474503B2Thin film magnetic head wafer with identification informationHITACHI METALS LTD·Filed 2006·Granted Jan 6, 2009·0 cites·13 claims
- 1157US2025305966A1Inspecting method and stack substratePROTERIAL LTD·Filed 2025·Application pending·0 cites
- 1255US7354699B2Method for producing alignment markHITACHI METALS LTD·Filed 2003·Granted Apr 8, 2008·4 cites·12 claims
- 1355US7187523B2Method of marking sintered body and method for manufacturing magnetic head waferNEOMAX CO LTD·Filed 2004·Granted Mar 6, 2007·2 cites·11 claims
- 1449US2023084128A1Silicon carbide substrate and method of manufacturing the sameHITACHI METALS LTD·Filed 2022·Application pending·0 cites
- 1547US7203031B2Substrate for thin-film magnetic head and method of manufacturing the substrateNEOMAX CO LTD·Filed 2002·Granted Apr 10, 2007·1 cites·11 claims
- 1647US6837941B2Cleaning and handling methods of electronic component and cleaning apparatus thereofNEOMAX CO LTD·Filed 1999·Granted Jan 4, 2005·16 cites·6 claims
- 1737US2004134418A1SiC substrate and method of manufacturing the sameFiled 2003·Application pending·0 cites
- 1836US2011156058A1Silicon carbide monocrystal substrate and manufacturing method thereforHITACHI METALS LTD·Filed 2010·Application pending·0 cites
- 1930US6301086B1Thin-film magnetic head supporting structure and method for manufacturing the sameSUMITOMO SPEC METALS·Filed 1999·Granted Oct 9, 2001·0 cites·18 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →