Inventor · disambiguated record
Takayuki Hisaka
Also filed as: HISAKA TAKAYUKI
11 granted patents·2 pending applications·27 citations·filing 1996–2019
82Inventor score
Top patents by PatentIndex Score
13 records- 0154US5677574AAirbridge wiring structure for MMICMITSUBISHI ELECTRIC CORP·Filed 1996·Granted Oct 14, 1997·22 cites·28 claims
- 0249US12033905B2Semiconductor device and method for manufacturing the sameMITSUBISHI ELECTRIC CORP·Filed 2019·Granted Jul 9, 2024·0 cites·21 claims
- 0344US2009200644A1Semiconductor device and method for manufacturing semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2008·Application pending·0 cites
- 0443US10388585B2Semiconductor device and method of manufacturing the sameMITSUBISHI ELECTRIC CORP·Filed 2017·Granted Aug 20, 2019·0 cites·8 claims
- 0543US6876011B1Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2003·Granted Apr 5, 2005·2 cites·5 claims
- 0642US11088074B2Semiconductor device and method for manufacturing sameMITSUBISHI ELECTRIC CORP·Filed 2017·Granted Aug 10, 2021·0 cites·5 claims
- 0741US11967537B2Semiconductor apparatus and semiconductor apparatus leak inspection methodMITSUBISHI ELECTRIC CORP·Filed 2018·Granted Apr 23, 2024·0 cites·16 claims
- 0841US10790397B2Semiconductor device and method for manufacturing the sameMITSUBISHI ELECTRIC CORP·Filed 2017·Granted Sep 29, 2020·0 cites·5 claims
- 0941US2005167698A1Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2005·Application pending·0 cites
- 1040US9627282B2Method of manufacturing semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2016·Granted Apr 18, 2017·0 cites·7 claims
- 1136US10224294B2Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2016·Granted Mar 5, 2019·0 cites·19 claims
- 1235US8766445B2Semiconductor deviceHISAKA TAKAYUKI·Filed 2012·Granted Jul 1, 2014·0 cites·5 claims
- 1331US5728611AMethod of fabricating semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 1996·Granted Mar 17, 1998·3 cites·2 claims
Join the waitlist — get patent alerts
Get an alert when Takayuki Hisaka files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →