Inventor · disambiguated record
Tatsuya Hitomi
Also filed as: HITOMI TATSUYA
9 granted patents·10 pending applications·42 citations·filing 1997–2023
82Inventor score
Files withMITSUBISHI CHEM CORP6TOKUYAMA CORP5HITOMI TATSUYA4MITSUBISHI ENG PLASTICS CORP2MIYAMOTO MASAAKI2
Top patents by PatentIndex Score
19 records- 0172US8158730B2Polyamide resinMIYAMOTO MASAAKI·Filed 2007·Granted Apr 17, 2012·2 cites·13 claims
- 0267US10815334B2Polyester resin, production method for said polyester resin, and polyester resin compositionMITSUBISHI CHEM CORP·Filed 2018·Granted Oct 27, 2020·0 cites·12 claims
- 0367US2020377650A1Polyester resin, production method for said polyester resin, and polyester resin compositionMITSUBISHI CHEM CORP·Filed 2020·Application pending·0 cites
- 0462US6265081B1Integrally molded articles of polyamide resinsMITSUBISHI ENG PLASTICS CORP·Filed 1999·Granted Jul 24, 2001·21 cites·11 claims
- 0561US2009306330A1Polyamide resin and hinged molded productMITSUBISHI CHEM CORP·Filed 2009·Application pending·0 cites
- 0657US9771477B2Polycarbonate resin composition, method for producing same and molded article of this resin compositionHITOMI TATSUYA·Filed 2016·Granted Sep 26, 2017·0 cites·11 claims
- 0756US8362191B2Polyamide resin and hinged molded productMITSUBISHI CHEM CORP·Filed 2010·Granted Jan 29, 2013·0 cites·5 claims
- 0856US5853831AVibration welded hollow moldings of polyamide resin compositionMITSUBISHI ENG PLASTICS CORP·Filed 1997·Granted Dec 29, 1998·19 cites·13 claims
- 0955US2014018498A1Polycarbonate resin composition, method for producing same and molded article of this resin compositionHITOMI TATSUYA·Filed 2013·Application pending·0 cites
- 1054US2025011971A1Group iii nitride single crystal substrate producing method, and aluminum nitride single crystal substrateTOKUYAMA CORP·Filed 2022·Application pending·0 cites
- 1154US2024170293A1Silicon Etching Solution, Method for Treating Substrate, and Method for Manufacturing Silicon DeviceTOKUYAMA CORP·Filed 2023·Application pending·0 cites
- 1254US2024254389A1Silicon etching solution, method of treating silicon substrate, and method of manufacturing semiconductor deviceTOKUYAMA CORP·Filed 2023·Application pending·0 cites
- 1354US2024170294A1Silicon Etching Solution, Method for Treating Substrate, and Method for Manufacturing Silicon DeviceTOKUYAMA CORP·Filed 2023·Application pending·0 cites
- 1453US2024067878A1Silicon etching solution and method for producing silicon etching solution, method for treating substrate, and method for producing silicon deviceTOKUYAMA CORP·Filed 2023·Application pending·0 cites
- 1552US2013030112A1Polycarbonate resin composition, method for producing same and molded article of this resin compositionHITOMI TATSUYA·Filed 2012·Application pending·0 cites
- 1649US2007249783A1Polyamide Resin and Hinged Molded ProductMIYAMOTO MASAAKI·Filed 2005·Application pending·0 cites
- 1748US9522519B2Polycarbonate resin laminateMITSUBISHI CHEM CORP·Filed 2014·Granted Dec 20, 2016·0 cites·16 claims
- 1842US9193825B2Polycarbonate resin, polycarbonate resin composition and molded article thereofMITSUBISHI CHEM CORP·Filed 2014·Granted Nov 24, 2015·0 cites·13 claims
- 1938US9777152B2Polycarbonate resin composition, method for producing same and molded article of this resin compositionHITOMI TATSUYA·Filed 2012·Granted Oct 3, 2017·0 cites·33 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →