Inventor · disambiguated record
Takaharu Hondo
Also filed as: HONDO TAKAHARU
8 granted patents·5 pending applications·11 citations·filing 2008–2019
78Inventor score
Top patents by PatentIndex Score
13 records- 0181US9910552B2Wiring body, wiring board, touch sensor, and method for producing wiring bodyFUJIKURA LTD·Filed 2016·Granted Mar 6, 2018·5 cites·11 claims
- 0272US10379645B2Wiring body, wiring board, touch sensor and method for producing wiring bodyFUJIKURA LTD·Filed 2015·Granted Aug 13, 2019·2 cites·16 claims
- 0367US8894892B2Mold and manufacturing method thereforFUJIKURA LTD·Filed 2013·Granted Nov 25, 2014·1 cites·7 claims
- 0461US10394398B2Wiring body, wiring board, wiring structure, and touch sensorFUJIKURA LTD·Filed 2016·Granted Aug 27, 2019·1 cites·15 claims
- 0554US8502086B2Laminated wiring board and method for manufacturing the sameHONDO TAKAHARU·Filed 2008·Granted Aug 6, 2013·2 cites·7 claims
- 0647US2012305179A1Mold and manufacturing method thereforHONDO TAKAHARU·Filed 2012·Application pending·0 cites
- 0744US10486398B2Conductor-layer-equipped structure and touch panelFUJIKURA LTD·Filed 2016·Granted Nov 26, 2019·0 cites·18 claims
- 0843US10345936B2Method for producing conductor-layer-provided structure, substrate-provided wiring body, substrate-provided structure, and touch sensorFUJIKURA LTD·Filed 2016·Granted Jul 9, 2019·0 cites·15 claims
- 0943US2013025120A1Wiring board and manufacturing method for sameFUJIKURA LTD·Filed 2012·Application pending·0 cites
- 1040US9232662B2Manufacturing method for wiring boardHONDO TAKAHARU·Filed 2012·Granted Jan 5, 2016·0 cites·3 claims
- 1140US2014168920A1Component-mounting printed board and method of manufacturing the sameFUJIKURA LTD·Filed 2014·Application pending·0 cites
- 1240US2020404789A1Wiring board including metal piece and method for manufacturing wiring board including metal pieceFUJIKURA LTD·Filed 2019·Application pending·0 cites
- 1338US2012216946A1Method of manufacturing wiring substrateHONDO TAKAHARU·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →