Inventor · disambiguated record
Takashi Hosaka
Also filed as: HOSAKA TAKASHI
23 granted patents·8 pending applications·340 citations·filing 1988–2025
95Inventor score
Top patents by PatentIndex Score
31 records- 0191US4954867ASemiconductor device with silicon oxynitride over refractory metal gate electrode in LDD structureSEIKO INSTR INC·Filed 1988·Granted Sep 4, 1990·106 cites·10 claims
- 0285US10249483B2Ultra-compact mass analysis device and ultra-compact particle acceleration deviceHOSAKA TAKASHI·Filed 2015·Granted Apr 2, 2019·5 cites·18 claims
- 0384US10804087B2Ultra-compact mass analysis device and ultra-compact particle acceleration deviceHOSAKA TAKASHI·Filed 2019·Granted Oct 13, 2020·3 cites·18 claims
- 0484US6475897B1Semiconductor device and method of forming semiconductor deviceSEIKO INSTR INC·Filed 2000·Granted Nov 5, 2002·38 cites·9 claims
- 0584US5149669AMethod of forming an isolation region in a semiconductor deviceSEIKO INSTR INC·Filed 1988·Granted Sep 22, 1992·69 cites·2 claims
- 0682US2025367833A1Conveyance apparatus, substrate processing apparatus, conveyance method, and article manufacturing methodCANON KK·Filed 2025·Application pending·0 cites
- 0775US12409558B2Conveyance apparatus, substrate processing apparatus, conveyance method, and article manufacturing methodCANON KK·Filed 2023·Granted Sep 9, 2025·0 cites·13 claims
- 0873US5030588AMethod of making semiconductor device with film resistorSEIKO INSTR INC·Filed 1989·Granted Jul 9, 1991·29 cites·19 claims
- 0971US5118636AProcess for forming isolation trench in ion-implanted regionSEIKO INSTR INC·Filed 1988·Granted Jun 2, 1992·36 cites·10 claims
- 1068US12214529B2Conveyance apparatus, planarization apparatus, and article manufacturing methodCANON KK·Filed 2022·Granted Feb 4, 2025·0 cites·13 claims
- 1165US5210043AProcess for producing semiconductor deviceSEIKO INSTR INC·Filed 1990·Granted May 11, 1993·26 cites·3 claims
- 1262US8417548B2Medical service support apparatusARAKI HIROYUKI·Filed 2011·Granted Apr 9, 2013·1 cites·2 claims
- 1359US10534344B2Operation management system and measurement systemFANUC CORP·Filed 2017·Granted Jan 14, 2020·0 cites·7 claims
- 1455US11474482B2Electronic watchCITIZEN WATCH CO LTD·Filed 2019·Granted Oct 18, 2022·0 cites·17 claims
- 1554US6528354B1Method of manufacturing a semiconductor deviceSEIKO INSTR INC·Filed 2001·Granted Mar 4, 2003·6 cites·11 claims
- 1654US2013204635A1Schedule presentation deviceOLYMPUS MEDICAL SYSTEMS CORP·Filed 2013·Application pending·0 cites
- 1752US9639080B2Controller for controlling machine tool and robotFANUC CORP·Filed 2014·Granted May 2, 2017·0 cites·2 claims
- 1851US10948819B2Imprint apparatus and article manufacturing methodCANON KK·Filed 2018·Granted Mar 16, 2021·0 cites·19 claims
- 1945US10551753B2Imprint device, substrate conveying device, imprinting method, and method for manufacturing articleCANON KK·Filed 2016·Granted Feb 4, 2020·0 cites·10 claims
- 2042US2018275616A1WatchCITIZEN WATCH CO LTD·Filed 2018·Application pending·0 cites
- 2139US5293061ASemiconductor device having an isolation layer region on the side wall of a grooveSEIKO INSTR INC·Filed 1992·Granted Mar 8, 1994·8 cites·16 claims
- 2239US2005143840A1Controller managing systemFANUC LTD·Filed 2004·Application pending·0 cites
- 2335US2002066937A1Structure of a semiconductor module and method of manufacturing the sameFiled 2001·Application pending·0 cites
- 2435US2003042594A1Semiconductor package and method of manufacturing leadFiled 2001·Application pending·0 cites
- 2535US2002068375A1Structure of a semiconductor module and method of manufacturing the sameFiled 2001·Application pending·0 cites
- 2635US2003052417A1Semiconductor deviceFiled 2001·Application pending·0 cites
- 2733US5001527ASemiconductor device with thin insulation filmSEIKO INSTR INC·Filed 1990·Granted Mar 19, 1991·5 cites·13 claims
- 2832US5234863AMethod of manufacturing doped contacts to semiconductor devicesSEIKO INSTR INC·Filed 1991·Granted Aug 10, 1993·4 cites·16 claims
- 2931US6329274B1Method of producing semiconductor deviceSEIKO INSTR INC·Filed 1992·Granted Dec 11, 2001·3 cites·7 claims
- 3030US6544852B1Method of fabricating semiconductor deviceSEIKO INSTR INC·Filed 1993·Granted Apr 8, 2003·1 cites·6 claims
- 3130US5352626AMethod for making a semiconductor device having an isolated layer region on the side wall of a grooveSEIKO INSTR INC·Filed 1993·Granted Oct 4, 1994·0 cites·2 claims
Join the waitlist — get patent alerts
Get an alert when Takashi Hosaka files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →