Inventor · disambiguated record
Tadahide Hoshi
Also filed as: HOSHI TADAHIDE
7 granted patents·343 citations·filing 1988–1997
88Inventor score
Technology areasH10P
Files withTOSHIBA KK7
Top patents by PatentIndex Score
7 records- 0190US5273553AApparatus for bonding semiconductor substratesTOSHIBA KK·Filed 1992·Granted Dec 28, 1993·143 cites·9 claims
- 0281US4935386AMethod of manufacturing semiconductor device including substrate bonding and outdiffusion by thermal heatingTOSHIBA KK·Filed 1988·Granted Jun 19, 1990·51 cites·9 claims
- 0380US5129827AMethod for bonding semiconductor substratesTOSHIBA KK·Filed 1990·Granted Jul 14, 1992·73 cites·12 claims
- 0465US5951755AManufacturing method of semiconductor substrate and inspection method thereforTOSHIBA KK·Filed 1997·Granted Sep 14, 1999·33 cites·20 claims
- 0558US5196375AMethod for manufacturing bonded semiconductor bodyTOSHIBA KK·Filed 1991·Granted Mar 23, 1993·31 cites·17 claims
- 0636US5068704AMethod of manufacturing semiconductor deviceTOSHIBA KK·Filed 1990·Granted Nov 26, 1991·7 cites·7 claims
- 0730US5352625AMethod of manufacturing semiconductor substrateTOSHIBA KK·Filed 1991·Granted Oct 4, 1994·5 cites·3 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →