Inventor · disambiguated record
Tae-Hoe Hwang
Also filed as: HWANG TAE-HOE
2 granted patents·1 pending application·10 citations·filing 2004–2008
58Inventor score
Technology areasH10W
Files withSAMSUNG ELECTRONICS CO LTD3
Top patents by PatentIndex Score
3 records- 0172US7374966B2Apparatus for stacking semiconductor chips, method for manufacturing semiconductor package using the same and semiconductor package manufactured therebySAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted May 20, 2008·5 cites·2 claims
- 0252US7135353B2Apparatus for stacking semiconductor chips, method for manufacturing semiconductor package using the same and semiconductor package manufactured therebySAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Nov 14, 2006·5 cites·8 claims
- 0347US2008191364A1Apparatus for stacking semiconductor chips, method for manufacturing semiconductor package using the same and semiconductor package manufactured therebySAMSUNG ELECTRONICS CO LTD·Filed 2008·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →