Inventor · disambiguated record
Taejoo Hwang
Also filed as: HWANG TAEJOO
2 granted patents·5 pending applications·18 citations·filing 2004–2024
57Inventor score
Top patents by PatentIndex Score
7 records- 0179US8039939B2Embedded wiring board, semiconductor package including the same and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2009·Granted Oct 18, 2011·16 cites·7 claims
- 0267US10141289B2Semiconductor packages having package-on-package structuresSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Nov 27, 2018·2 cites·17 claims
- 0352US2025038112A1Semiconductor package including a plurality of semiconductor chipsSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0440US2014291830A1Semiconductor packages having package-on-package structuresHWANG TAEJOO·Filed 2014·Application pending·0 cites
- 0535US2014327156A1Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Application pending·0 cites
- 0633US2015155268A1Semiconductor package deviceHWANG TAEJOO·Filed 2014·Application pending·0 cites
- 0733US2007072330A1Wafer bonding compatible with bulk micro-machiningRENSSELAER POLYTECH INST·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →