Inventor · disambiguated record
Takashi Ichiryu
Also filed as: ICHIRYU TAKASHI
40 granted patents·8 pending applications·278 citations·filing 2005–2023
97Inventor score
Files withPANASONIC CORP19PANASONIC IP MAN CO LTD15MATSUSHITA ELECTRIC INDUSTRIAL CO LTD7HIRANO KOICHI2ICHIRYU TAKASHI2
Top patents by PatentIndex Score
48 records- 0198US9844133B2Flexible substrate including stretchable sheetPANASONIC IP MAN CO LTD·Filed 2016·Granted Dec 12, 2017·29 cites·19 claims
- 0297US7748110B2Method for producing connection memberPANASONIC CORP·Filed 2007·Granted Jul 6, 2010·50 cites·8 claims
- 0396US7258549B2Connection member and mount assembly and production method of the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2005·Granted Aug 21, 2007·61 cites·23 claims
- 0491US7773386B2Flexible substrate, multilayer flexible substratePANASONIC CORP·Filed 2007·Granted Aug 10, 2010·13 cites·11 claims
- 0590US8525172B2Flexible semiconductor devicePANASONIC CORP·Filed 2012·Granted Sep 3, 2013·9 cites·8 claims
- 0690US7205483B2Flexible substrate having interlaminar junctions, and process for producing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2005·Granted Apr 17, 2007·17 cites·20 claims
- 0789US10228806B2Flexible touch sensor and method of manufacturing the samePANASONIC IP MAN CO LTD·Filed 2017·Granted Mar 12, 2019·6 cites·18 claims
- 0887US9860979B2Stretchable flexible substrate including first insulating layer, second insulating layer, first metal layer, and second metal layerPANASONIC IP MAN CO LTD·Filed 2016·Granted Jan 2, 2018·5 cites·12 claims
- 0986US7910403B2Metal particles-dispersed composition and flip chip mounting process and bump-forming process using the samePANASONIC CORP·Filed 2006·Granted Mar 22, 2011·12 cites·10 claims
- 1085US7242823B2Optical transmission channel board, board with built-in optical transmission channel, and data processing apparatusMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2005·Granted Jul 10, 2007·12 cites·8 claims
- 1183US7981528B2Magnetic sheet with stripe-arranged magnetic grains, RFID magnetic sheet, magnetic shielding sheet and method of manufacturing the samePANASONIC CORP·Filed 2007·Granted Jul 19, 2011·12 cites·29 claims
- 1281US8367488B2Manufacturing method of flexible semiconductor devicePANASONIC CORP·Filed 2010·Granted Feb 5, 2013·6 cites·16 claims
- 1381US8283246B2Flip chip mounting method and bump forming methodKITAE TAKASHI·Filed 2011·Granted Oct 9, 2012·4 cites·7 claims
- 1478US12355444B2Gate drive circuit, and semiconductor breakerPANASONIC IP MAN CO LTD·Filed 2023·Granted Jul 8, 2025·0 cites·4 claims
- 1578US12316322B2Gate drive circuit, and semiconductor breakerPANASONIC IP MAN CO LTD·Filed 2023·Granted May 27, 2025·0 cites·5 claims
- 1678US9330811B2Transparent electrode and method for manufacturing the samePANASONIC IP MAN CO LTD·Filed 2013·Granted May 3, 2016·2 cites·25 claims
- 1778US7531754B2Flexible substrate having interlaminar junctions, and process for producing the samePANASONIC CORP·Filed 2007·Granted May 12, 2009·6 cites·11 claims
- 1877US8343822B2Flexible semiconductor device and method for manufacturing samePANASONIC CORP·Filed 2009·Granted Jan 1, 2013·5 cites·12 claims
- 1976US7951700B2Flip chip mounting method and bump forming methodPANASONIC CORP·Filed 2006·Granted May 31, 2011·5 cites·9 claims
- 2076US7726545B2Flip chip mounting process and bump-forming process using electrically-conductive particles as nucleiPANASONIC CORP·Filed 2006·Granted Jun 1, 2010·8 cites·9 claims
- 2173US7321496B2Flexible substrate, multilayer flexible substrate and process for producing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2005·Granted Jan 22, 2008·3 cites·15 claims
- 2269US7875496B2Flip chip mounting method, flip chip mounting apparatus and flip chip mounting bodyPANASONIC CORP·Filed 2006·Granted Jan 25, 2011·5 cites·12 claims
- 2367US11791803B2Gate drive circuit, and semiconductor breakerPANASONIC IP MAN CO LTD·Filed 2020·Granted Oct 17, 2023·0 cites·9 claims
- 2465US7927997B2Flip-chip mounting method and bump formation methodPANASONIC CORP·Filed 2006·Granted Apr 19, 2011·3 cites·8 claims
- 2564US7754529B2Flip chip mounting body and method for mounting such flip chip mounting body and bump forming methodPANASONIC CORP·Filed 2006·Granted Jul 13, 2010·2 cites·14 claims
- 2662US8525178B2Flexible semiconductor device and method for producing the sameICHIRYU TAKASHI·Filed 2011·Granted Sep 3, 2013·2 cites·33 claims
- 2757US8064213B2Module with a built-in component, and electronic device with the sameASAHI TOSHIYUKI·Filed 2005·Granted Nov 22, 2011·1 cites·23 claims
- 2855US2017098490A1Base material with a transparent conductive film, method for manufacturing the same, touch panel, and solar cellPANASONIC IP MAN CO LTD·Filed 2016·Application pending·0 cites
- 2952US7851281B2Manufacturing method of flexible semiconductor device and flexible semiconductor devicePANASONIC CORP·Filed 2008·Granted Dec 14, 2010·0 cites·20 claims
- 3052US2015255186A1Base material with a transparent conductive film, method for manufacturing the same, touch panel, and solar cellPANASONIC IP MAN CO LTD·Filed 2015·Application pending·0 cites
- 3152US2011133137A1Metal particles-dispersed composition and flip chip mounting process and bump-forming process using the sameHIRANO KOICHI·Filed 2011·Application pending·0 cites
- 3249US7732920B2Flip chip mounting body, flip chip mounting method and flip chip mounting apparatusPANASONIC CORP·Filed 2006·Granted Jun 8, 2010·0 cites·6 claims
- 3349US2007224735A1Optical transmission channel board, board with built-in optical transmission channel, and data processing apparatusMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2007·Application pending·0 cites
- 3448US8691683B2Flip-chip mounting method and bump formation methodHIRANO KOICHI·Filed 2011·Granted Apr 8, 2014·0 cites·8 claims
- 3547US7977741B2Manufacturing method of flexible semiconductor device and flexible semiconductor devicePANASONIC CORP·Filed 2010·Granted Jul 12, 2011·0 cites·4 claims
- 3647US2010182144A1Rfid magnetic sheet, noncontact ic card and portable mobile communication apparatusPANASONIC CORP·Filed 2007·Application pending·0 cites
- 3746US11637552B2Driver circuit and switch systemPANASONIC IP MAN CO LTD·Filed 2020·Granted Apr 25, 2023·0 cites·15 claims
- 3846US8617943B2Method for making a semiconductor device on a flexible substrateICHIRYU TAKASHI·Filed 2009·Granted Dec 31, 2013·0 cites·12 claims
- 3945US12125904B2Bidirectional switch module and bidirectional switchPANASONIC IP MAN CO LTD·Filed 2020·Granted Oct 22, 2024·0 cites·16 claims
- 4045US8071425B2Flip chip mounting body, flip chip mounting method and flip chip mounting apparatusNAKATANI SEIICHI·Filed 2010·Granted Dec 6, 2011·0 cites·11 claims
- 4145US2007262470A1Module With Built-In Semiconductor And Method For Manufacturing The ModuleMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2005·Application pending·0 cites
- 4244US12126274B2Bidirectional switch, electrical device, and multi-level inverterPANASONIC IP MAN CO LTD·Filed 2019·Granted Oct 22, 2024·0 cites·5 claims
- 4344US2015206819A1Electronic component package and method for manufacturing the samePANASONIC IP MAN CO LTD·Filed 2013·Application pending·0 cites
- 4443US10083889B2Electronic component package including sealing resin layer, metal member, ceramic substrate, and electronic component and method for manufacturing the samePANASONIC CORP·Filed 2017·Granted Sep 25, 2018·0 cites·17 claims
- 4542US11257733B2Semiconductor device including heat-dissipating metal multilayer having different thermal conductivity, and method for manufacturing samePANASONIC IP MAN CO LTD·Filed 2018·Granted Feb 22, 2022·0 cites·18 claims
- 4642US2009085227A1Flip-chip mounting body and flip-chip mounting methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2006·Application pending·0 cites
- 4741US11062981B2Bidirectional switch and bidirectional switch device including the switchPANASONIC CORP·Filed 2018·Granted Jul 13, 2021·0 cites·20 claims
- 4839US9812385B2Electronic component package including electronic component, metal member, and sealing resinPANASONIC IP MAN CO LTD·Filed 2016·Granted Nov 7, 2017·0 cites·9 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →