Inventor · disambiguated record
Tadashi Iida
Also filed as: IIDA TADASHI
14 granted patents·4 pending applications·140 citations·filing 1994–2016
91Inventor score
Top patents by PatentIndex Score
18 records- 0184US5754621AX-ray inspection method and apparatus, prepreg inspecting method, and method for fabricating multi-layer printed circuit boardHITACHI LTD·Filed 1996·Granted May 19, 1998·56 cites·46 claims
- 0280US6805915B2Electroless copper plating solution, electroless copper plating process and production process of circuit boardHITACHI LTD·Filed 2002·Granted Oct 19, 2004·15 cites·8 claims
- 0372US8008393B2Automobile water-based paintKANSAI PAINT CO LTD·Filed 2008·Granted Aug 30, 2011·2 cites·14 claims
- 0471US9647518B2Method for manufacturing laminated iron coreMITSUI HIGH TEC INC·Filed 2015·Granted May 9, 2017·2 cites·10 claims
- 0567US6831009B2Wiring substrate and an electroless copper plating solution for providing interlayer connectionsHITACHI LTD·Filed 2001·Granted Dec 14, 2004·7 cites·4 claims
- 0664US6900394B1Electroless copper plating machine, and multi-layer printed wiring boardHITACHI LTD·Filed 2000·Granted May 31, 2005·5 cites·4 claims
- 0763US7169216B2Electroless copper plating solution, electroless copper plating process and production process of circuit boardHITACHI LTD·Filed 2004·Granted Jan 30, 2007·4 cites·3 claims
- 0861US2007079727A1Electroless copper plating solution, electroless copper plating process and production process of circuit boardITABASHI TAKEYUKI·Filed 2006·Application pending·0 cites
- 0960US10751782B2Method for processing laminated materialMITSUI HIGH TEC INC·Filed 2016·Granted Aug 25, 2020·0 cites·12 claims
- 1056US9641055B2Method for manufacturing laminated iron coreMITSUI HIGH TEC INC·Filed 2015·Granted May 2, 2017·0 cites·11 claims
- 1156US8906465B2Method for forming multilayer coating filmOGAWA JUNYA·Filed 2008·Granted Dec 9, 2014·0 cites·10 claims
- 1256US5645364AStructure for joining plate elementsFUJI HEAVY IND LTD·Filed 1995·Granted Jul 8, 1997·17 cites·8 claims
- 1355US2005252684A1Electroless copper plating machine thereof, and multi-layer printed wiring boardITABASHI TAKEYIKI·Filed 2005·Application pending·0 cites
- 1452US6989329B2Method of manufacturing a wiring substrate and an electroless copper plating solution for providing interlayer connectionsHITACHI LTD·Filed 2004·Granted Jan 24, 2006·3 cites·2 claims
- 1545US5476210AStructure for joining plate elements and method for joining the sameFUJI HEAVY IND LTD·Filed 1994·Granted Dec 19, 1995·14 cites·8 claims
- 1641US5930382AWiring pattern inspecting method and system for carrying out the sameHITACHI LTD·Filed 1996·Granted Jul 27, 1999·15 cites·32 claims
- 1737US2010322506A1Inspection parameter setting method, inspection property evaluation method and inspection systemMURAMATSU YOSHINORI·Filed 2010·Application pending·0 cites
- 1837US2003183120A1Electroless copper plating solution, the electroless copper plating supplementary solution, and the method of manufacturing wiring boardFiled 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →